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2
T5321 Series
T5421 Series
5 x 7 mm Surface Mount High Reliability
Tristate/Non-Tristate, 1MHz to 100MHz
Parameter
Condition
Shock
1000 Gs, 0.35 ms, sine wave, 3 shocks in each plane
Vibration
10-2000 Hz of .06” d.a. or 20Gs, whichever is less
Humidity
Resistant to 85° R.H. at 85°C
Leak
Per MIL-STD-883, Method 1014, Cond. A1 and C1
Case
Hermetically sealed ceramic LCC
Pads
40 microinch of gold over nickel
Resistance
to Solvents
Per MIL-STD-202, Method 215
Marking
Epoxy ink or laser engraved
FIXED OUTPUT
TRISTATE
Operating
Temperature
Frequency
Stability
Model
T5321
T5421
-55
C to +85C
±25 ppm
T5322
T5422
-55
C to +85C
±50 ppm
T5323
T5423
-55
C to +125C
±75 ppm
T5324
T5424
-55
C to +125C
±50 ppm
Environmental and Mechanical Conditions
Thermal Characteristics
Thermal Resistance
From Junction to Case, Rjc
16 °C/Watt
Surface Mount Application
These packages are designed for reflow soldering
in accordance with recommended profiles. For
hand-soldering, the temperature of the iron should
not exceed 400°C for three seconds.
Table 1
Each unit undergoes the following:
1. Stabilization Bake
MIL-STD-883 Method 1008, Cond,.B
2. Temperature Cycling
MIL-STD-883 Method 1010, Cond, B
3. Constant Acceleration
MIL-STD-883 Method 2001, Cond, A
4. Burn-in
MIL-STD-883 Method 1015, Cond B
(125°C for 168 hours with bias)
5. Fine Leak
MIL-STD-883 Method 1014, Cond. A1
6. Gross Leak
MIL-STD-883 Method 1014, Cond C
7. Electrical Test at 25°C and temperature extremes, as follows:
A. Frequency
F. Duty Cycle
B. Current
G. Frequency at 3.65V
C. Rise Time
H. Frequency at 3.0V
D. Fall Time
I. “Zero” logic level
E. Duty Cycle
J. “One” logic level
K. Tristate
Test Data on each unit is available for additional cost