參數(shù)資料
型號(hào): SY89842U
廠商: Micrel Semiconductor,Inc.
英文描述: Precision CML Runt Pulse Eliminator 2:1 Multiplexer
中文描述: 精密白血病短脈沖消除2:1多路復(fù)用器
文件頁數(shù): 5/16頁
文件大?。?/td> 668K
代理商: SY89842U
Micrel, Inc.
SY89842U
March 2005
M9999-030805
hbwhelp@micrel.com
or (408) 955-1690
5
Absolute Maximum Ratings
(1)
Supply Voltage (V
CC
) ..........................–0.5V to +4.0V
Input Voltage (V
IN
) ..................................–0.5V to V
CC
CML Output Voltage (V
OUT
) .. V
CC
–1.0V to V
CC
+0.5V
CML Input Current (I
IN
) ...............................................
Source/Sink Current on IN, /IN ................ ±50mA
Source/Sink Current on V
T
..................... ±100mA
V
REF-AC
Current
Source/Sink Current on V
REF-AC
.................. ±2mA
Lead Temperature (soldering, 20 sec.) ..........+260°C
Storage Temperature (T
s
)..................–65°C to 150°C
DC Electrical Characteristics
(4)
T
A
= –40°C to +85°C, unless otherwise stated.
Operating Ratings
(2)
Supply Voltage (V
CC
).................. +2.375V to +2.625V
......................................................+3.0V to +3.6V
Ambient Temperature (T
A
)................ –40°C to +85°C
Package Thermal Resistance
MLF (
θ
JA
)
Still-Air.....................................................60°C/W
MLF (
ψ
JB
)
Junction-to-Board....................................33°C/W
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
CC
Power Supply
2.375
3.0
2.625
3.6
V
V
I
CC
R
IN
Power Supply Current
No load, max V
CC
83
110
mA
Input Resistance
(IN-to-V
T
)
Differential Input Resistance
(IN-to-/IN)
45
50
55
R
DIFF_IN
90
100
110
V
IH
Input High Voltage
(IN, /IN)
1.2
V
CC
V
V
IL
Input Low Voltage
(IN, /IN)
0
V
IH
–0.1
V
V
IN
Input Voltage Swing
(IN, /IN)
See Figure 1a. Note 5.
0.1
V
CC
V
V
DIFF_IN
Differential Input Voltage Swing
|IN-/IN|
See Figure 1b.
0.2
V
V
IN_FSI
Input Voltage Threshold that
Triggers FSI
30
100
mV
V
T_IN
IN-to-V
T
(IN, /IN)
1.8
V
V
REF-AC
Output Reference Voltage
V
CC
–1.3
V
CC
–1.2
V
CC
–1.1
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
θ
JA
and
ψ
JB
values are determined for a 4-layer board in still air unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. V
IN
(max) is specified when V
T
is floating.
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