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Micrel, Inc.
SY87725L
July 2007
9
M9999-071007-B
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(1)
Supply Voltage (V
CC
) ................................. –0.5V to + 4.6V
Input Voltage (V
IN
)............................................ –0.5V to VCC
LVDS Output Current (I
OUT
)...................................... ±10mA
CML Outputs
Voltage......................................... VCC-1.0V to VCC+0.5V
Current ................................................................. ±25mA
Lead Temperature (soldering, 20 sec.) .................. +260°C
Storage Temperature (T
S
) ........................–65°C to +150°C
Operating Ratings(2)
Supply Voltage (V
CC
) ............................+3.15V to +3.45V
Ambient Temperature (T
A
) ..................... –40°C to +85°C
Package Thermal Resistance
(3)
MLF
θ JB
Still-Air ............................................................ 35°C/W
MLF
ψJB
Junction-to-Board ............................................ 7°C/W
DC Electrical Characteristics(4)
TA = –40°C to +85°C, unless noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
3.15
3.3
3.45
V
ICC
Power Supply Current
No load, max. VCC
300
380
mA
LVPECL Electrical Characteristics(4)
VCC = VCCA = VCCO = 3.3V ±5%; GND = GNDA = 0V; TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VIH
Input HIGH Voltage
VCC–1.165
VCC–0.88
V
VIL
Input LOW Voltage
VCC–1.810
VCC–1.475
V
CML Output Electrical Characteristics(4)
VCC = VCCA = VCCO = 3.3V ±5%; GND = GNDA = 0V; TA = –40°C to +85°C, unless otherwise noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VOH
Output HIGH Voltage
VCC–0.020
VCC–0.010
VCC
V
VOUT
Output LOW Voltage
325
400
mV
VDIFF_OUT
Differential Output Voltage
650
800
mV
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions
for extended periods may affect device reliability
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. θJB
assumes a 4-layer PCB. ψ JA in still air unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.