參數(shù)資料
型號: SY58608U
廠商: Micrel Semiconductor,Inc.
英文描述: 3.2Gbps Precision, 1:2 LVDS Fanout Buffer with Internal Termination and Fail Safe Input
中文描述: 3.2Gbps速率精密,1:2 LVDS扇出緩沖器,內(nèi)部終止和故障安全輸入
文件頁數(shù): 3/12頁
文件大小: 286K
代理商: SY58608U
Micrel, Inc.
SY58608U
October 2006
3
M9999-102706-A
hbwhelp@micrel.com
or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (V
CC
)................................. –0.5V to +4.0V
Input Voltage (V
IN
).............................. –0.5V to V
CC
+0.3V
LVDS Output Current (I
OUT
) ................................... ±10mA
Input Current
Source or Sink Current on (IN, /IN)................. ±50mA
Current (V
REF
)
Source or sink current on V
REF-AC
Maximum Operating Junction Temperature............125°C
Lead Temperature (soldering, 20sec.)....................260°C
Storage Temperature (T
s
)......................–65°C to +150°C
(4)
............... ±1.5mA
Operating Ratings
(2)
Supply Voltage (V
IN
) ........................+2.375V to +2.635V
Ambient Temperature (T
A
) .....................–40°C to +85°C
Package Thermal Resistance
MLF
Still-air (
θ
JA
).............................................60°C/W
Junction-to-board (
ψ
JB
)...........................33°C/W
DC Electrical Characteristics
(5)
T
A
= –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
CC
I
CC
Power Supply Voltage Range
2.375
2.5
2.625
V
Power Supply Current
No load, max. V
CC
55
75
mA
R
DIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
V
IH
Input HIGH Voltage
(IN, /IN)
IN, /IN
1.2
V
CC
V
V
IL
Input LOW Voltage
(IN, /IN)
IN, /IN
0
V
IH
–0.1
V
V
IN
Input Voltage Swing
(IN, /IN)
see Figure 3a,
Note 6
0.1
1.7
V
V
DIFF_IN
Differential Input Voltage Swing
(|IN - /IN|)
see Figure 3b
0.2
V
V
IN_FSI
Input Voltage Threshold that
Triggers FSI
30
100
mV
V
REF-AC
Output Reference Voltage
V
CC
–1.3
V
CC
–1.2
V
CC
–1.1
V
IN to V
T
Voltage from Input to V
T
1.28
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions
for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB.
ψ
JB
and
θ
JA
values are determined for a 4-layer board in still-air number, unless otherwise stated.
4. Due to the limited drive capability, use for input of the same package only.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. V
IN
(max) is specified when V
T
is floating.
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