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參數(shù)資料
型號(hào): SY10EP16VZI
廠商: Micrel Inc
文件頁數(shù): 5/6頁
文件大?。?/td> 0K
描述: IC RCVR HS DIFF 5V/3.3V 8-SOIC
標(biāo)準(zhǔn)包裝: 95
系列: 10EP
邏輯類型: 差分接收器/驅(qū)動(dòng)器
電源電壓: 3 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SOIC
包裝: 管件
Micrel, Inc.
SY89202U
August 2007
5
M9999-083107-C
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings
(1)
Supply Voltage (VCC) .......................... –0.5V to +4.0V
Input Voltage (VIN) .................................. –0.5V to VCC
Termination Current
Source or sink current on VT...................±100mA
Output Current
Source or sink current on IN, /IN .............. ±50mA
VREF-AC Current
Source or sink current on VREF-AC ............±1.5mA
Lead Temperature (soldering, 20 sec.) .......... +260C
Storage Temperature (Ts) ................. –65C to 150C
Operating Ratings
(2)
Supply Voltage (VCC).................. +2.375V to +2.625V
..................................................... +3.0V to +3.6V
Ambient Temperature (TA) ................ –40C to +85C
Package Thermal Resistance
(3)
QFN (
θ
JA)
Still-Air ..................................................... 35C/W
QFN (
ψ
JB)
Junction-to-Board .................................... 20C/W
DC Electrical Characteristics
(4)
TA =–40°C to +85°C, unless noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Power Supply
2.375
3.0
2.625
3.6
V
ICC
Power Supply Current
No load, max. VCC
125
180
mA
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
90
100
110
RIN
Input Resistance
(IN-to-VT)
45
50
55
VIH
Input High Voltage
(IN, /IN)
1.2
VCC
V
VIL
Input Low Voltage
(IN, /IN)
0
VIH–0.1
V
VIN
Input Voltage Swing
(IN, /IN)
See Figure 1a.
0.1
VCC
V
VDIFF_IN
Differential Input Voltage Swing
|IN-/IN|
See Figure 1b.
0.2
V
VREF-AC
Output Reference Voltage
(VREF-AC)
VCC–1.3
VCC–1.2
VCC–1.1
V
IN-to-VT
Voltage from Input to VT
1.8
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended
periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
θ
JA and ψJB
values are determined for a 4-layer board in still air, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
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