參數(shù)資料
型號(hào): SWLP.2450.12.4.B.02
廠商: Taoglas Limited
文件頁數(shù): 13/13頁
文件大小: 1387K
描述: ANTENNA WI-FI WLAN 2.4GHZ
標(biāo)準(zhǔn)包裝: 1
天線類型: 陶瓷貼片
頻帶數(shù)目: 1
頻率: 2.4GHz
VSWR: 3
增益: 2dBi
端子: 表面貼裝型
安裝類型: 表面貼裝
高度(最大): 0.157"(4mm)
包裝: *
其它名稱: 931-1115-6
SPE-13-8-007/B/SS  |  page 13 of 13
6. Recommended Reflow Temperature Profile
Temp(癈)
240 癈
230 癈
180 癈
0?C
60-120sec
10-30sec
Time (s)
5 sec (Peak 245癈)
6.1 Flux, Solder
6.2 Reflow soldering conditions
6.3 Reworking with soldering iron
" Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt%(chlorine conversion value).
" Use Sn solder.
" Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150 max.
   Cooling into solvent after soldering also should be in such a way that temperature difference is limited to 100 max.
  Unwrought pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
Pre-heating
150? 1 min
Tip temperature
290?max
Soldering iron output
30w max
Soldering time
3 second max
" The following conditions must be strictly followed when using a soldering iron
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