參數(shù)資料
型號： STPCD0113BTC3
元件分類： 32位微控制器
英文描述： 32-Bit Microprocessor
中文描述： 32位微處理器
文件頁數(shù)： 55/61頁
文件大?。?/td> 1007K
代理商： STPCD0113BTC3
BOARD LAYOUT
Issue 2.2 - October 13, 2000
55/61
The PBGA Package also dissipates heat through
peripheral ground balls. When a heat sink is
placed on the device, heat is more uniformely
spread throughout the moulding increasing heat
dissipation through the peripheral ground balls.
The more via pads are connected to each ground
ball, the more heat is dissipated . The only limita-
tion is the risk of lossing routing channels.
Figure 6-5
shows a routing with a good trade off
between thermal dissipation and number of rout-
ing channels.
Figure 6-4. Optimum layout for central ground ball
Via to Ground layer
hole diameter = 14 mil
Pad for ground ball
diameter = 25 mil
connections = 10 mil
Clearance = 6mil
External diameter = 37 mil
Solder mask
diameter = 33 mil
Figure 6-5. Global ground layout for good thermal dissipation
Ground pad
Via to ground layer
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STPCD0166BTA3 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:PC Compatible Embedded Microprocessor
STPCD0166BTC3 制造商:STMicroelectronics 功能描述:MPU STPC RISC 64-Bit 66MHz 388-Pin BGA
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STPCD0175BTC3 功能描述:微處理器 - MPU 75MHz x86 Embedded RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
STPCD0175BTI3 功能描述:微處理器 - MPU 75MHz x86 Embedded RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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