參數(shù)資料
型號: STM32F103RCT7
廠商: STMICROELECTRONICS
元件分類: 微控制器/微處理器
英文描述: 32-BIT, FLASH, 72 MHz, RISC MICROCONTROLLER, PQFP64
封裝: 10 X 10 MM, 0.50 MM PITCH, ROHS COMPLIANT, LQFP-64
文件頁數(shù): 14/118頁
文件大?。?/td> 1508K
代理商: STM32F103RCT7
Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
110/118
6.2
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max x ΘJA)
Where:
TA max is the maximum ambient temperature in °C,
ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
Table 70.
Package thermal characteristics
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LFBGA144 - 10 × 10 mm / 0.5 mm pitch
40
°C/W
Thermal resistance junction-ambient
LQFP144 - 20 × 20 mm / 0.5 mm pitch
30
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.5 mm pitch
40
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
46
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
45
Thermal resistance junction-ambient
WLCSP64
50
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