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參數(shù)資料
| 型號(hào)： | STDELIV |
| 元件分類： | 熱敏電阻 |
| 英文描述： | Resettable Fuse; Operating Voltage Max:30V; Resistance:0.05ohm; Holding Current:4A; Tripping Current:8A; Initial Resistance Min:0.01ohm; Mounting Type:Through Hole; Terminal Type:Radial Leaded; Thermistor Tolerance:+/- 5% |
| 中文描述： | 訂購(gòu)信息包和交貨 |
| 文件頁數(shù)： | 2/2頁 |
| 文件大?。?/td> | 31K |
| 代理商： | STDELIV |
SMARTCARD MCU
2/2
Table 4. Ordering Information Scheme
Note:
*where “y” indicates the sawing orientation as shown in Figure 2
Figure 2. Sawing orientation
Sawn wafers are scribed and mounted in a frame
on adhesive tape. The orientation is defined by the
position of the GND pad on the die, viewed with
active area of product visible, relative to the notch-
es of the frame (as shown in Figure 2). The orien-
tation of the die with respect to the plastic frame
notches is specified by the Customer.
One further concern, when specifying devices to
be delivered in this form, is that wafers mounted
on adhesive tape must be used within a limited pe-
riod from the mounting date:
– two months, if wafers are stored at 25°C, 55%
relative humidity
– six months, if wafers are stored at 4°C, 55% rel-
ative humidity
Example:
ST19SF08C
D45
XXX
Z
Product name
Pre-personalization name
“+” if no pre-personalization
Delivery Form
Customer ROM code name
Dxx: Module contact or dual
Cxx: Contactless modules
Oxx: SO package
Wxx: Unsawn wafer
Sxy*: Sawn wafer (std UV tape)
Rxy*: Sawn wafer (insolated UV tape) or SO on tape and reel
AI02171
1
ORIENTATION
GND
GND
GND
GND
2
3
4
VIEW: WAFER FRONT SIDE
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