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參數(shù)資料
| 型號： | SSM2211SZ-REEL71 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | Low Distortion, 1.5 W Audio Power Amplifier |
| 中文描述： | 低失真，1.5 W音頻功率放大器 |
| 文件頁數(shù)： | 2/24頁 |
| 文件大?。?/td> | 408K |
| 代理商： | SSM2211SZ-REEL71 |
SSM2211
TABLE OF CONTENTS
Features..............................................................................................1
Applications.......................................................................................1
Functional Block Diagram..............................................................1
General Description.........................................................................1
Revision History...............................................................................2
Electrical Characteristics.................................................................3
Absolute Maximum Ratings............................................................5
Thermal Resistance......................................................................5
ESD Caution..................................................................................5
Pin Configurations and Function Descriptions...........................6
Typical Performance Characteristics.............................................7
Product Overview...........................................................................14
Thermal Performance—LFCSP................................................14
Typical Applications.......................................................................15
Bridged Output vs. Single-Ended Output Configurations...15
Speaker Efficiency and Loudness.............................................15
REVISION HISTORY
11/06—Rev. C to Rev. D
Updated Format..................................................................Universal
Changes to General Description .................................................... 1
Changes to Electrical Characteristics ............................................ 3
Changes to Absolute Maximum Ratings....................................... 5
Added Table 6.................................................................................... 6
Changes to Figure 32......................................................................11
Changes to the Product Overview Section.................................14
Changes to the Output Voltage Headroom Section...................17
Changes to the Start-Up Popping Noise Section........................18
Changes to the Evaluation Board Section...................................20
Updated Outline Dimensions.......................................................21
Changes to Ordering Guide..........................................................21
10/04—Data Sheet Changed from Rev. B to Rev. C
Updated Format..................................................................Universal
Changes to General Description .................................................... 1
Changes to Table 5............................................................................ 4
Deleted Thermal Performance—SOIC Section ........................... 8
Changes to Figure 31......................................................................10
Changes to Figure 40......................................................................12
Changes to Thermal Performance—LFCSP Section.................13
Deleted Figure 52, Renumbered Successive Figures..................14
Deleted Printed Circuit Board Layout—SOIC Section.............14
Changes to Output Voltage Headroom Section.........................16
Changes to Start-Up Popping Noise Section..............................17
Changes to Ordering Guide..........................................................20
Rev. D | Page 2 of 24
Power Dissipation....................................................................... 16
Output Voltage Headroom........................................................ 17
Automatic Shutdown-Sensing Circuit..................................... 17
Shutdown-Circuit Design Example......................................... 18
Start-Up Popping Noise............................................................. 18
SSM2211 Amplifier Design Example.................................. 18
Single-Ended Applications........................................................ 19
Driving Two Speakers Single Endedly..................................... 19
Evaluation Board........................................................................ 20
LFCSP Printed Circuit Board Layout Considerations .......... 20
Outline Dimensions....................................................................... 21
Ordering Guide .......................................................................... 21
10/02—Data Sheet Changed from Rev. A to Rev. B
Deleted 8-Lead PDIP.........................................................Universal
Updated Outline Dimensions....................................................... 15
5/02—Data Sheet Changed from Rev. 0 to Rev. A
Edits to General Description ...........................................................1
Edits to Package Type .......................................................................3
Edits to Ordering Guide...................................................................3
Edits to Product Overview...............................................................8
Edits to Printed Circuit Board Layout Considerations............. 13
Added section Printed Circuit Board Layout
Considerations—LFCSP................................................................ 14
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