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參數(shù)資料
| 型號： | SPC5604PGF0MLQ6 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 47/104頁 |
| 文件大小： | 0K |
| 描述： | IC MCU 32BIT 512KB FLASH 144LQFP |
| 標準包裝： | 60 |
| 系列： | MPC56xx Qorivva |
| 核心處理器： | e200z0h |
| 芯體尺寸： | 32-位 |
| 速度： | 64MHz |
| 連通性： | CAN，F(xiàn)lexRay，LIN，SPI，UART/USART |
| 外圍設備： | DMA，POR，PWM，WDT |
| 輸入/輸出數(shù)： | 108 |
| 程序存儲器容量： | 512KB（512K x 8） |
| 程序存儲器類型： | 閃存 |
| EEPROM 大小： | 64K x 8 |
| RAM 容量： | 40K x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 3 V ~ 5.5 V |
| 數(shù)據(jù)轉換器： | A/D 30x10b |
| 振蕩器型： | 內部 |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | 144-LQFP |
| 包裝： | 托盤 |
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MPC5604P Microcontroller Data Sheet, Rev. 8
Freescale
47
3.5.2
General notes for specifications at maximum junction temperature
TJ = TA + (RJA * PD)
Eqn. 1
where:
TA
= ambient temperature for the package (°C)
RJA
= junction to ambient thermal resistance (°C/W)
PD
= power dissipation in the package (W)
The junction to ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal
performance. Unfortunately, there are two values in common usage: the value determined on a single layer board and the value
obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which
value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a
single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed in Equation 2 as the sum of a junction to case thermal resistance
and a case to ambient thermal resistance:
RJA = RJC + RCA
Eqn. 2
where:
RJA
= junction to ambient thermal resistance (°C/W)
RJC
= junction to case thermal resistance (°C/W)
RCA
= case to ambient thermal resistance (°C/W)
RJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the case to
ambient thermal resistance, RCA. For instance, the user can change the size of the heat sink, the air flow around the device, the
interface material, the mounting arrangement on printed circuit board, or change the thermal dissipation on the printed circuit
board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the Thermal
Characterization Parameter (
JT) can be used to determine the junction temperature with a measurement of the temperature at
the top center of the package case using Equation 3:
TJ = TT + (JT x PD)
Eqn. 3
where:
TT
= thermocouple temperature on top of the package (°C)
JT
= thermal characterization parameter (°C/W)
PD
= power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the
junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects
of the thermocouple wire.
References:
5 Thermal characterization parameter indicating the temperature difference between the case and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal
characterization parameter is written as Psi-JC.
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| SPC5604PGF1MLL6 | 功能描述:32位微控制器 - MCU 512K FLASH, 40K SRAM RoHS:否 制造商:Texas Instruments 核心:C28x 處理器系列:TMS320F28x 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:90 MHz 程序存儲器大小:64 KB 數(shù)據(jù) RAM 大小:26 KB 片上 ADC:Yes 工作電源電壓:2.97 V to 3.63 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:LQFP-80 安裝風格:SMD/SMT |
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