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參數(shù)資料
| 型號： | SP8059W |
| 英文描述： | 10 Channel Photo Detector IC |
| 中文描述： | 10頻道照片檢測器IC |
| 文件頁數(shù)： | 3/4頁 |
| 文件大?。?/td> | 77K |
| 代理商： | SP8059W |
ADVANCED
SP8059
Rev 0.7e (05-17-05) SP8059 Ten-Channel Photo detector IC Copyright 2005 Sipex Corporation
SIPEX RESERVES THE RIGHT TO MAKE CHANGES TO THIS DATASHEET. CALL FOR UPDATES: 1-408-934-7500.
SIPEX CONFIDENTIAL, PRELIMINARY & PROPRIETARY. DO NOT DISTRIBUTE OR
COPY
page
3
of
4
16-PIN ORGANIC LEADLESS CHIP CARRIER (OLCC) PACKAGE DIMENSIONS
Dimensions, millimeters
Dim.
Min.
A
0.85
A1
A2
0.25
A3
A4
1.15
A5
0.54
A6
0.48
b
0.2
D
4.9
D1
4.3
D2
E
3.9
E1
3.3
E2
e
L
0.5
J
Nom.
0.96
0.36 ref
0.30
0.6 ref
1.31
0.68
0.57
0.25
5.0
4.4
3.4 ref
4.0
3.4
2.4ref
0.5 BSC
0.6
3.5 BSC
Max.
1.07
0.35
1.47
0.82
0.66
0.3
5.1
4.5
4.1
3.5
0.7
Location of the photo detectors in a package
X0 = 0 ± 50
μ
m
Y0 = 0 ± 50
μ
m
Z0 (A6) = 570 ± 90
μ
m
Θ
= 0 ± 1.0
0
Optical center stability X, Y to
package soldering reference in any
radial direction at overall operational
temperature and life time ………
Optical center stability Z to package
soldering reference over operational
temperature range, including optical
window properties …
Tilt to optical surface die with respect
to soldering reference …………
< TBD
< TBD
< 1%
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