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參數(shù)資料
| 型號： | SN74LVC1G58YEAR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 標準邏輯 |
| 英文描述： | SPECIALTY LOGIC CIRCUIT, BGA6 |
| 封裝： | MO-211EA, DSBGA-6 |
| 文件頁數(shù)： | 16/17頁 |
| 文件大?。?/td> | 491K |
| 代理商： | SN74LVC1G58YEAR |
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74LVC1G58DBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1G58DBVRE4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1G58DBVRG4
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1G58DCKR
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1G58DCKRE4
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1G58DCKRG4
ACTIVE
SC70
DCK
6
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1G58DRLR
ACTIVE
SOP
DRL
6
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1G58DRLRG4
ACTIVE
SOP
DRL
6
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVC1G58YEAR
NRND
WCSP
YEA
6
3000
TBD
SNPB
Level-1-260C-UNLIM
SN74LVC1G58YEPR
NRND
WCSP
YEP
6
3000
TBD
SNPB
Level-1-260C-UNLIM
SN74LVC1G58YZAR
NRND
WCSP
YZA
6
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SN74LVC1G58YZPR
ACTIVE
WCSP
YZP
6
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
Addendum-Page 1
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SN74LVC1G58YEPR | 功能描述:IC CONFIG MULTI FUNCTION 6DSBGA RoHS:是 類別:集成電路 (IC) >> 邏輯 - 柵極和逆變器 - 多功能，可配置 系列:74LVC 產(chǎn)品變化通告:Product Obsolescence 05/Oct/2010 標準包裝:100 系列:- 邏輯類型:可配置多功能 電路數(shù):2 輸入數(shù):2 施密特觸發(fā)器輸入:無 輸出類型:差分 輸出電流高，低:- 電源電壓:2.375 V ~ 3.465 V 工作溫度:-40°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:16-LBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:16-FCBGA（4x4） 包裝:帶卷 (TR) |
| SN74LVC1G58YZAR | 功能描述:IC CONFIG MULTI FUNCTION 6DSBGA RoHS:是 類別:集成電路 (IC) >> 邏輯 - 柵極和逆變器 - 多功能，可配置 系列:74LVC 產(chǎn)品變化通告:Product Obsolescence 05/Oct/2010 標準包裝:100 系列:- 邏輯類型:可配置多功能 電路數(shù):2 輸入數(shù):2 施密特觸發(fā)器輸入:無 輸出類型:差分 輸出電流高，低:- 電源電壓:2.375 V ~ 3.465 V 工作溫度:-40°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:16-LBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:16-FCBGA（4x4） 包裝:帶卷 (TR) |
| SN74LVC1G58YZPR | 功能描述:邏輯門 CnfgrbleMultFnctnGt RoHS:否 制造商:Texas Instruments 產(chǎn)品:OR 邏輯系列:LVC 柵極數(shù)量:2 線路數(shù)量（輸入/輸出）:2 / 1 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 傳播延遲時間:3.8 ns 電源電壓-最大:5.5 V 電源電壓-最小:1.65 V 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DCU-8 封裝:Reel |
| SN74LVC1G66DBVR | 功能描述:模擬開關(guān) IC Single Bilateral RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關(guān)閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| SN74LVC1G66DBVRE4 | 功能描述:模擬開關(guān) IC 10Bit FET Bus Switch W/Level Shifting RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關(guān)閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
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