參數(shù)資料
型號: SN74LVC1G34DCKR
廠商: TEXAS INSTRUMENTS INC
元件分類: 門電路
英文描述: LVC/LCX/Z SERIES, 1-INPUT NON-INVERT GATE, PDSO5
封裝: GREEN, PLASTIC, SO-70, 5 PIN
文件頁數(shù): 12/24頁
文件大小: 1157K
代理商: SN74LVC1G34DCKR
A
2
4
Y
A
1
3
Y
SCES519H – DECEMBER 2003 – REVISED JULY 2008................................................................................................................................................... www.ti.com
ORDERING INFORMATION
TOP-SIDE
TA
PACKAGE(1)
ORDERABLE PART NUMBER
MARKING(2)
NanoFree – WCSP (DSBGA)
SN74LVC1G34YFPR
_ _ _ C9_
0.23-mm Large Bump – YFP
Reel of 3000
NanoFree – WCSP (DSBGA)
SN74LVC1G34YZPR
_ _ _ C9_
0.23-mm Large Bump – YZP
NanoFree – WCSP (DSBGA)
_ _ _ _
Reel of 3000
SN74LVC1G34YZVR
0.23-mm Large Bump – YZV (Pb-free)
C9
–40°C to 85°C
Reel of 3000
SN74LVC1G34DBVR
SOT (SOT-23) –DBV
C34_
Reel of 250
SN74LVC1G34DBVT
Reel of 3000
SN74LVC1G34DCKR
SOT (SC-70) – DCK
Reel of 250
SN74LVC1G34DCKT
C9_
SOT (SOT-553) – DRL
Reel of 4000
SN74LVC1G34DRLR
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YFP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2
has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
FUNCTION TABLE
INPUT
OUTPUT
A
Y
H
L
LOGIC DIAGRAM (POSITIVE LOGIC)
(DBV, DCK, DRL, and YZP Package)
LOGIC DIAGRAM (POSITIVE LOGIC)
(YFP and YZV Package)
2
Copyright 2003–2008, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC1G34
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