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參數(shù)資料
| 型號： | SN74LV1G79YZPR |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 鎖存器 |
| 英文描述： | LV/LV-A/LVX/H SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, BGA5 |
| 封裝： | LEAD FREE, DSBGA-5 |
| 文件頁數(shù)： | 1/18頁 |
| 文件大?。?/td> | 523K |
| 代理商： | SN74LV1G79YZPR |
SN74LVC1G79
SINGLE POSITIVEEDGETRIGGERED DTYPE FLIPFLOP
SCES220P APRIL 1999 REVISED JUNE 2005
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
and NanoFree Packages
D Supports 5-V VCC Operation
D Inputs Accept Voltages to 5.5 V
D Max tpd of 4 ns at 3.3 V
D Low Power Consumption, 10-A Max ICC
D ±24-mA Output Drive at 3.3 V
D Ioff Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
3
2
4
5
1
DVCC
Q
CLK
GND
DBV PACKAGE
(TOP VIEW)
YEA, YEP, YZA,
OR YZP PACKAGE
(BOTTOM VIEW)
DCK PACKAGE
(TOP VIEW)
3
2
4
5
1
DVCC
Q
CLK
GND
3
2
4
5
1
DVCC
Q
CLK
GND
D
GND
VCC
Q
CLK
DRL PACKAGE
(TOP VIEW)
See mechanical drawings for dimensions.
1
4
2
3
5
description/ordering information
This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on
the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related
to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without
affecting the level at the output.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE PART NUMBER
TOP-SIDE MARKING
NanoStar
WCSP (DSBGA)
0.17-mm Small Bump YEA
SN74LVC1G79YEAR
NanoFree
WCSP (DSBGA)
0.17-mm Small Bump YZA (Pb-free)
Reel of 3000
SN74LVC1G79YZAR
_ _ _CR_
NanoStar
WCSP (DSBGA)
0.23-mm Large Bump YEP
Reel of 3000
SN74LV1G79YEPR
_ _ _CR_
40
°C to 85°C
NanoFree
WCSP (DSBGA)
0.23-mm Large Bump YZP (Pb-free)
SN74LV1G79YZPR
SOT (SOT-23) DBV
Reel of 3000
SN74LVC1G79DBVR
C79_
SOT (SOT-23) DBV
Reel of 250
SN74LVC1G79DBVT
C79_
SOT (SC-70) DCK
Reel of 3000
SN74LVC1G79DCKR
SOT (SC-70) DCK
Reel of 250
SN74LVC1G79DCKT
CR_
SOT (SOT-553) DRL
Reel of 4000
SN74LVC1G79DRLR
CR_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
Copyright
2005, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
NanoStar and NanoFree are trademarks of Texas Instruments.
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