PACKAGE OPTION ADDENDUM
www.ti.com
7-Jun-2010
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
SN74LS646DW
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS646DWE4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS646DWG4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74LS646NT
ACTIVE
PDIP
NT
24
15
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS646NT3
OBSOLETE
PDIP
NT
24
TBD
Call TI
Samples Not Available
SN74LS646NTE4
ACTIVE
PDIP
NT
24
15
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS647DW
OBSOLETE
SOIC
DW
24
TBD
Call TI
Samples Not Available
SN74LS647NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Samples Not Available
SN74LS648NT
ACTIVE
PDIP
NT
24
15
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS648NTE4
ACTIVE
PDIP
NT
24
15
Pb-Free (RoHS)
CU NIPDAU N / A for Pkg Type
SN74LS649NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Samples Not Available
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.