參數(shù)資料
型號: SN74AVCH1T45YEPR
廠商: TEXAS INSTRUMENTS INC
元件分類: 總線收發(fā)器
英文描述: AVC SERIES, 1-BIT TRANSCEIVER, TRUE OUTPUT, BGA6
封裝: DSBGA-6
文件頁數(shù): 1/24頁
文件大小: 458K
代理商: SN74AVCH1T45YEPR
www.ti.com
FEATURES
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
VCCA
GND
A
VCCB
DIR
B
3
2
1
4
5
6
A
GND
VCCA
B
DIR
VCCB
YEP OR YZP PACKAGE
(BOTTOM VIEW)
DESCRIPTION/ORDERING INFORMATION
SN74AVCH1T45
SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
SCES598C – JULY 2004 – REVISED OCTOBER 2005
Available in the Texas Instruments
NanoStar and NanoFree Packages
Control Inputs VIH/VIL Levels Are Referenced
to VCCA Voltage
Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over the Full 1.2-V to
3.6-V Power-Supply Range
I/Os Are 4.6-V Tolerant
Ioff Supports Partial-Power-Down Mode
Operation
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Latch-Up Performance Exceeds 100 mA Per
xxxx
JESD 78, Class II
xxxx
ESD Protection Exceeds JESD 22
xxxx
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
xxxx
– 1000-V Charged-Device Model (C101)
This single-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is
designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track
VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional
translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
The SN74AVCH1T45 is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input.
The SN74AVCH1T45 is designed so that the DIR input is powered by VCCA.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar – WCSP (DSBGA)
SN74AVCH1T45YEPR
0.23-mm Large Bump – YEP
Tape and reel
_ _ _TF_
NanoFree – WCSP (DSBGA)
SN74AVCH1T45YZPR
–40
°C to 85°C 0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
Tape and reel
SN74AVCH1T45DBVR
ET1_
SOT (SC-70) – DCK
Tape and reel
SN74AVCH1T45DCKR
TF_
(1)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2)
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright 2004–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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