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SN54LVT16952, SN74LVT16952
3.3-V ABT 16-BIT REGISTERED TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS151D – MAY 1992 – REVISED AUGUST 1996
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V
Operation and Low-Static Power
Dissipation
Members of the Texas Instruments
Widebus
Family
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V V
CC
)
Support Unregulated Battery Operation
Down to 2.7 V
Typical V
OLP
(Output Ground Bounce)
< 0.8 V at V
CC
= 3.3 V, T
A
= 25
°
C
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model
(C = 200 pF, R = 0)
Latch-Up Performance Exceeds 500 mA
Per JEDEC Standard JESD-17
Bus-Hold Data Inputs Eliminate the Need
for External Pullup Resistors
Support Live Insertion
Distributed V
CC
and GND Pin Configuration
Minimizes High-Speed Switching Noise
Flow-Through Architecture Optimizes
PCB Layout
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
Using 25-mil Center-to-Center Spacings
description
The ’LVT16952 are 16-bit registered transceivers designed for low-voltage (3.3-V) V
CC
operation, but with the
capability to provide a TTL interface to a 5-V system environment. These devices can be used as two 8-bit
transceivers or one 16-bit transceiver. Data on the A or B bus is stored in the registers on the low-to-high
transition of the clock (CLKAB or CLKBA) input provided that the clock-enable (CLKENAB or CLKENBA) input
is low. Taking the output-enable (OEAB or OEBA) input low accesses the data on either port.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
To ensure the high-impedance state during power up or power down, OE should be tied to V
CC
through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74LVT16952 is available in TI’s shrink small-outline (DL) and thin shrink small-outline (DGG) packages,
which provide twice the I/O pin count and functionality of standard small-outline packages in the same
printed-circuit-board area.
Copyright
1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Widebus is a trademark of Texas Instruments Incorporated.
1OEBA
1CLKBA
1CLKENBA
GND
1B1
1B2
V
CC
1B3
1B4
1B5
GND
1B6
1B7
1B8
2B1
2B2
2B3
GND
2B4
2B5
2B6
V
CC
2B7
2B8
GND
2CLKENBA
2CLKBA
2OEBA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
1OEAB
1CLKAB
1CLKENAB
GND
1A1
1A2
V
CC
1A3
1A4
1A5
GND
1A6
1A7
1A8
2A1
2A2
2A3
GND
2A4
2A5
2A6
V
CC
2A7
2A8
GND
2CLKENAB
2CLKAB
2OEAB
SN54LVT16952 . . . WD PACKAGE
SN74LVT16952 . . . DGG OR DL PACKAGE
(TOP VIEW)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.