參數(shù)資料
型號(hào)： SMLW010G
英文描述： SMLW010 Single-Output Low-Profile Power Modules: 36 Vdc to 75 Vdc Input; 10 W
中文描述： SMLW010單輸出低壓電源模塊簡介：36伏到75伏直流輸入; 10瓦
文件頁數(shù)： 6/16頁
文件大小： 222K
代理商： SMLW010G
Data Sheet
January 2002
Power Modules: 36 Vdc to 75 Vdc Input; 10 W
SMLW010 Single-Output Low-Profile
6
Tyco Electronics Corp.
Test Configurations
8-203
Note: Input reflected-ripple current is measured with a simulated
source impedance of 12 μH. Capacitor Cs offsets possible
battery impedance. Current is measured at the input of the
module.
Figure 1. Input Reflected-Ripple Test Setup
8-513
Note: Use one 0.1 μF ceramic capacitor. Scope measurement should
be made using a BNC socket. Position the load between 50
mm and 75 mm (2 in. and 3 in.) from the module.
Figure 2. Peak-to-Peak Output Noise Measurement
Test Setup
8-204(C)
Note: All measurements are taken at the module terminals. When
socketing, place Kelvin connections at module terminals to
avoid measurement errors due to socket contact resistance.
O
(+)
V
O
(–)
–
V
I
(+)
V
I
(–)
–
[
Figure 3. Output Voltage and Efficiency
Measurement Test Setup
Design Considerations
Input Source Impedance
The power module should be connected to a low
ac-impedance input source. Highly inductive source
impedances can affect the stability of the power mod-
ule. If the source inductance exceeds 10 μH, a 33 μF
electrolytic capacitor (ESR < 0.7
at 100 kHz)
mounted close to the power module helps ensure
stability of the unit. (See Figure 1.)
Solder Recommendations
Large surface-mount components typically require a
thicker stencil than smaller components to ensure a
reliable solder joint. The SMLW010 Single-Output,
Low-Profile, PCB Mount Power Modules have been
evaluated for solder joint reliability and shock and vibra-
tion requirements using 170,000 cubic mils (2. 8mm
3
)
of solder. This volume can be obtained by printing sol-
der 12 mils thick on the copper pads or overprinting the
copper pads 13 mils (0.33 mm) around the pad area
with 8 mils of printed solder. Although this volume is
recommended, tests have been conducted using lower
volumes with successful results. Contact technical sup-
port for further assistance.
TO OSCILLOSCOPE
12 μH
C
S
220 μF
IMPEDANCE < 0.1
@ 20 C, 100 kHz
V
I
(+)
V
I
(-)
BATTERY
33 μF
CURRENT
PROBE
L
TEST
V
O
(+)
V
O
(–)
RESISTIVE
LOAD
SCOPE
0.1 μF
COPPER STRIP
V
I
(+)
V
I
(-)
V
O
(+)
V
O
(-)
I
I
I
O
SUPPLY
CONTACT RESISTANCE
CONTACT AND
DISTRIBUTION LOSSES
LOAD
η
]
I
O
]
I
I
-V
100 %
×
=
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