參數(shù)資料
型號(hào)： SME5224AUPA-360
元件分類： 微控制器/微處理器
英文描述： 64-BIT, 360 MHz, RISC PROCESSOR
文件頁(yè)數(shù)： 11/28頁(yè)
文件大?。?/td> 373K
代理商： SME5224AUPA-360
19
360 MHz CPU, 4.0 MB E-Cache
UltraSPARC-II CPU Module
SME5224AUPA-360
Preliminary Version
July 1999
Sun Microsystems, Inc
Thermal Denitions and Specications
Term
Denition
Specication
Comments
Tj
Maximum device junction
temperature
85
°C
The Tj can't be measured directly by a thermocouple
probe. It must always be estimated as Tj or less. Less is
preferred.
Tc
Maximum case
temperature
77.5
°C
Measurable at the top-center of the device. Requires a
hole in the base of the heatsink to allow thermocouple
to be in contact with the case. Maximum case is
specied using a CPU device at its maximum power
dissipation.
Ts
Heatsink temperature
75
°C
Measurable as the temperature of the base of the heat-
sink. The best approach is to embed a thermocouple in
a cavity drilled in the heatsink base. An alternative
approach is to place the thermocouple between the
ns/pins of the heatsink (insulated from the airow)
and in contact with the base plate of the heatsink.
Ta
Module ambient air
temperature
The air temperature as it approaches the heatsink.
Pd
Typical power dissipation
of the CPU
17.0 W
The worst case compute loads over the entire process
range.
θjc
Maximum junction-to-case
thermal resistance of the
package
0.5
°C/W
The specication for the UltraSPARC–II, 360 MHz
CPU in a ceramic LGA package.
θcs
Case-to-heatsink thermal
resistance
0.1
°C/W
Accuracy of this value requires that good thermal
contact is made between the package and the heatsink.
θsa
Heatsink-to-air thermal
resistance
This value is dependent on the heatsink design, the
airow direction, and the airow velocity.
Va
Air Velocity
The ducted airow.
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