
040617
WebSite Europe
Tel: +49 2302 662-107
Americas
Tel: +1 404 699-7820
Asia
Tel: +852 26 14-1108
www.wickmanngroup.com E-mail: sales@wickmann.com E-mail: service@wickmannusa.com E-mail: sales@wickmann.com.hk E-mail: sales@wickmann.cn
China
Tel: +86 21 6432-5146
1.2
1.0
1.0
1.5
Dimensions (mm)
Model A B C D
Min Max Min Max Min Max Min
E
Min Max tape
packaging quantity
SMD0805P010TS/
TF
2.00 2.20 1.20 1.50 0.55 1.00 0.10
SMD0805P020TS/
TF
2.00 2.20 1.20 1.50 0.55 1.00 0.10
SMD0805P035TS/
TF
2.00 2.20 1.20 1.50 0.45 0.75 0.10
SMD0805P050TS/
TF
2.00 2.20 1.20 1.50 0.75 1.25 0.10
SMD0805P075TS/
TF
2.00 2.20 1.20 1.50 0.75 1.25 0.20
SMD0805P100TS/
TF
2.00 2.20 1.20 1.50 0.80 1.80 0.20
0.20 0.45 4,000
0.20 0.45 4,000
0.20 0.45 4,000
0.20 0.45 3,000
0.15 0.45 3,000
0.15 0.45 2,000
SMD0805P010TS/
TF
0.10 0.30 15 40 1.50 @ 0.50 0.5 1.000
SMD0805P020TS/
TF
0.20 0.50 9 40 0.02 @ 8.00 0.5 0.650
SMD0805P035TS/
TF
0.35 0.75 6 40 0.10 @ 8.00 0.5 0.250
SMD0805P050TS/
TF
0.50 1.00 6 40 0.10 @ 8.00 0.5 0.150
SMD0805P075TS/
TF
0.75 1.50 6 40 0.20 @ 8.00 0.6 0.090
SMD0805P100TS/
TF
1.00 1.95 6 40 0.30 @ 8.00 0.6 0.060
3.500 6.000
2.000 3.500
0.750 1.200
0.500 0.850
t.b.d. 0.350 p p
t.b.d. 0.210 p p
c
T
Model I
I
V
I
max. time to trip P
Resistance Approvals
(A) (A) (V)
(A) (sec. @ A)
(W)
R
min.
(
)
R
typ.
(
)
R
I max.
(
)
Permissible continuous operating current is
≤
100 % at ambient temperature of 20 oC (68 oF).
Order Qty. Order- Model Packaging
Information Number
Please choose TS for SnPb and
TF
for Sn plating
P
OLYFUSE
R
ESETTABLE
F
USES
SMD0805
formerly No. 725
Dimensions (mm)
Speci
fi
cations
Packaging
A
Materials
Terminals:
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 oC to +85 oC (consider derating)
Humidity Ageing
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical
resistance change
Vibration
MIL-STD-883C, Method 2007.1, Condition A,
no change
Thermal Shock
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance
change
Solderability
Meets EIA Speci
fi
cation RS186-9E,
ANSI/J-STD-002, Category 3
Re
fl
ow only
Solvent Resistance
Blistertape and reel 178 mm
Solder-plated copper
TS: Solder Material: 63/37 SnPb
TF: Solder Material: Sn
MIL-STD-202, Method 215, no change
Marking
“P”, Part Code
SMD Type, 6 V / 9 V / 15V
Standard
UL 1434 1
st
Edition
CSA C22.2 No. 0 CSA TIL No. CA-3A
Approvals
cULus Recognition
TüV
Features
These devices offer wide range in hold currents
from 0.1 A to 1.0 A and voltages from 6 V to
15 V. The SMD0805 product line is suitable for
high density circuit board applications in com-
puters, cellular phone and general electronics.
Suitable for re
fl
ow soldering.
WebLinks
Further info see:
www.wickmanngroup.com
Further application info see fuseology:
www.wickmanngroup.com/download/fuseology.pdf
Solder pad Layout (mm)
NOTE:
I
hold
= Hold current: maximum current device will pass without tripping in 20 °C still air.
I
trip
=
Trip current: minimum current at which the device will trip in 20 °C still air.
V
max
= Maximum voltage device can withstand without damage at rated current (I
)
I
max
= Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
= Power dissipated from device when in the tripped state at 20 °C still air.
R
min
= Minimum resistance of device in initial (un-soldered) state.
R
= Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
Caution: Operation beyond the speci
fi
ed rating may result in damage and possible arcing and
fl
ame.
Speci
fi
cations are subject to change without notice