參數(shù)資料
型號: SC605EVB
廠商: Semtech Corporation
英文描述: Charge Pump Flash LED Driver
中文描述: 電荷泵閃光LED驅(qū)動器
文件頁數(shù): 10/12頁
文件大?。?/td> 356K
代理商: SC605EVB
0
2005 Semtech Corp.
www.semtech.com
POWER MANAGEMENT
Suggested Layout
The following layout is suggested for a two layer design with
one component side. The capacitors C and C2 are the
bucket capacitors
and each of these capacitors conducts
the full load current of up to 700mA pulsed on for one half
clock cycle per capacitor. C3 is the output decoupling ca-
pacitor, placed near the SC605. C is the input decoupling
capacitor, placed near the SC605. Multiple vias should be
used whenever it is necessary to change layers on nets
connecting to pins VIN, VOUT, GND, C1-, C1+, C2-, C2+.
Resistor R1 is routed with a very low resistance connection
between ISET and GND pin 3. The sense trace between
pin 7 and R1 is connected to R1 at the terminal pad for
the most accurate sensing possible.
SC605
The bottom copper layer is primarily a ground plane provid-
ing a return path between the ground vias at R1 and the
ground vias connecting pin 3 to the ground plane.
The SC605’s center thermal pad is tied to the ground plane
through a heat spreading copper shape with multiple vias.
There are 0 vias shown in this layout connecting the ther-
mal pad and pin 3 together to the ground plane. All 0 vias
help spread heat and conduct ground current. Note that
the thermal pad does not conduct current. Pin 3 conducts
the full ground current.
Four signal traces routed on the bottom layer are CTRL1,
CTRL0, FLASH and ISET. These traces are routed horizon
-
tally on the bottom layer. Carefully route these traces so
they do no block the ground path from R1 to the ground
pin 3.
TopCopper
BottomCopper
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