- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄385814 > SAA8122AEL (NXP SEMICONDUCTORS) Digital Still Camera Processor ImagIC family PDF資料下載
參數(shù)資料
| 型號(hào)： | SAA8122AEL |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費(fèi)家電 |
| 英文描述： | Digital Still Camera Processor ImagIC family |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PBGA324 |
| 封裝： | 16 X 16 MM, 1.20 MM HEIGHT, PLASTIC, MO-205, SOT-571-1, LFBGA-324 |
| 文件頁數(shù)： | 22/26頁 |
| 文件大?。?/td> | 885K |
| 代理商： | SAA8122AEL |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁當(dāng)前第22頁第23頁第24頁第25頁第26頁
Philips Semiconductors
SAA8122A
Digital Still Camera Processor (ImagIC family)
Objective specification
Rev. 01 — 20 April 2000
22 of 26
9397 750 07048
Philips Electronics N.V. 2000. All rights reserved.
10. Soldering
10.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering is not always suitable for surface mount ICs, or for printed-circuit boards
with high population densities. In these situations reflow soldering is often used.
10.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, infrared/convection heating in a
conveyor type oven. Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250
°
C. The top-surface
temperature of the packages should preferable be kept below 230
°
C.
10.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SAB-C504-2R24M | 8-Bit CMOS Microcontroller |
| SAB-C504-2R40M | 8-Bit CMOS Microcontroller |
| SAB-C504-2RM | 8-Bit CMOS Microcontroller |
| SAB-C504-L24M | 8-Bit CMOS Microcontroller |
| SAB-C504-L40M | 8-Bit CMOS Microcontroller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SAA8122E | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital Still Camera |
| SAA8122E/C1 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital Still Camera |
| SAA8200HL | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Ensation Base integrated wireless audio baseband |
| SAA8200HL/N100,518 | 制造商:ST-Ericsson 功能描述:SAA8200HL Series Ensation Base Integrated Wireless Audio Baseband - LQFP-100 |
| SAA8510EV1UM | 制造商:STMicroelectronics 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。