參數(shù)資料
型號(hào)： S71GL064A80BFW0F3
廠商： Spansion Inc.
英文描述： Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述： 堆疊式多芯片產(chǎn)品（MCP）的閃存和RAM
文件頁(yè)數(shù)： 12/102頁(yè)
文件大?。?/td> 1606K
代理商： S71GL064A80BFW0F3
12
S71GL032A Based MCPs
S71GL032A_00_A0 March 31, 2005
A d v a n c e I n f o r m a t i o n
Physical Dimensions
TLC056—56-ball Fine-Pitch Ball Grid Array (FBGA)
9 x 7 mm Package
3348 \ 16-038.22a
PACKAGE
TLC 056
JEDEC
N/A
D x E
9.00 mm x 7.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.20
PROFILE
A1
0.20
---
---
BALL HEIGHT
A2
0.81
---
0.97
BODY THICKNESS
D
9.00 BSC.
BODY SIZE
E
7.00 BSC.
BODY SIZE
D1
5.60 BSC.
MATRIX FOOTPRINT
E1
5.60 BSC.
MATRIX FOOTPRINT
MD
8
MATRIX SIZE D DIRECTION
ME
8
MATRIX SIZE E DIRECTION
n
φ
b
eE
56
BALL COUNT
0.35
0.40
0.45
BALL DIAMETER
0.80 BSC.
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A1,A8,D4,D5,E4,E5,H1,H8
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
E1
7
SE
A
D1
eD
D
C
E
F
G
H
8
7
6
4
3
2
1
eE
5
B
PIN A1
CORNER
7
SD
BOTTOM VIEW
C
0.08
0.20
C
A
E
B
C
0.15
(2X)
C
D
C
0.15
(2X)
INDEX MARK
10
6
b
TOP VIEW
SIDE VIEW
CORNER
56X
A1
A2
A
0.15 M
0.08
M
C
C
A B
PIN A1
相關(guān)PDF資料
PDF描述
S71PL254 STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
S71PL032J STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
S71PL032J04 STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
S71PL032J04-0B STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
S71PL032J04-0F STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71GL064AA0 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
S71GL064AA0-0K 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
S71GL064AA0-0P 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
S71GL064AA0-0U 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
S71GL064AA0-0Z 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*