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參數(shù)資料
| 型號(hào)： | S71GL064A80BFI0F0 |
| 廠商： | Spansion Inc. |
| 元件分類(lèi)： | 電感 |
| 英文描述： | INDUCTOR,TOROID,HORIZONTAL, 22.0 uH,7.0 IDC,0.015 OHM, |
| 中文描述： | 鋁電解電容器 |
| 文件頁(yè)數(shù)： | 77/102頁(yè) |
| 文件大?。?/td> | 1606K |
| 代理商： | S71GL064A80BFI0F0 |
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March 31, 2005 S71GL032A_00_A0
S71GL032A Based MCPs
77
A d v a n c e I n f o r m a t i o n
AC Characteristics
Alternate CE# Controlled Erase and Program Operations-S29GL064A
Notes:
1.
Not 100% tested.
2.
See the “Erase and Programming Performance” section for more information.
3.
For 1–16 words/1–32 bytes programmed.
4.
If a program suspend command is issued within t
POLL
, the device requires t
POLL
before reading status data, once
programming has resumed (that is, the program resume command has been written). If the suspend command was issued
after t
POLL
, status data is available immediately after programming has resumed. See
Figure 24
.
Parameter
Speed Options
Unit
J EDEC
Std.
Description
90
10
11
t
AVAV
t
WC
Write Cycle Time (Note 1)
Min
90
100
110
ns
t
AVWL
t
AS
Address Setup Time
Min
0
ns
t
ELAX
t
AH
Address Hold Time
Min
45
ns
t
DVEH
t
DS
Data Setup Time
Min
35
ns
t
EHDX
t
DH
Data Hold Time
Min
0
ns
t
GHEL
t
GHEL
Read Recovery Time Before Write (OE# High to WE# Low)
Min
0
ns
t
WLEL
t
WS
WE# Setup Time
Min
0
ns
t
EHWH
t
WH
WE# Hold Time
Min
0
ns
t
ELEH
t
CP
CE# Pulse Width
Min
35
ns
t
EHEL
t
CPH
CE# Pulse Width High
Min
25
ns
t
WHWH1
t
WHWH1
Write Buffer Program Operation (Notes 2, 3)
Typ
240
μs
Single Word Program Operation (Note 2)
Typ
60
Accelerated Single Word Program Operation (Note 2)
Typ
54
t
WHWH2
t
WHWH2
Sector Erase Operation (Note 2)
Typ
0.5
sec
t
RH
RESET# High Time Before Write
Min
50
ns
t
POLL
Program Valid before Status Polling (Note 5)
Max
4
μs
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| S71GL064A80BFI0F2 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A80BFI0F3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A80BFW0B2 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A80BFW0B3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A80BFW0F3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71GL064A80BFI0F2 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A80BFI0F3 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A80BFW0B0 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A80BFW0B2 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A80BFW0B3 | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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