參數(shù)資料
型號(hào)： S71GL064A80BAW0B2
廠商： Spansion Inc.
英文描述： Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述： 堆疊式多芯片產(chǎn)品（MCP）的閃存和RAM
文件頁數(shù)： 88/102頁
文件大?。?/td> 1606K
代理商： S71GL064A80BAW0B2
88
S71GL032A Based MCPs
S71GL032A_00_A0 March 31, 2005
A d v a n c e I n f o r m a t i o n
Notes:
1.
2.
If Chip Enable goes Inactive simultaneously with WE# = High, the output remains in a high-impedance state.
During the Don’t Care period in the Data I/O waveform, the I/Os are in output state and input signals should not be applied.
Notes:
1.
2.
If Chip Enable goes Inactive simultaneously with WE# = High, the output remains in a high-impedance state.
During the Don’t Care period in the Data I/O waveform, the I/Os are in output state and input signals should not be applied.
Figure 30. Write Cycle 3 (WE# Controlled, OE# Low)
Figure 31. Write Cycle 4 (BHE#/BLE# Controlled, OE# Low)
VALID DATA
t
HD
t
SD
t
LZWE
t
PWE
t
SA
t
HA
t
AW
t
SCE
t
WC
t
HZWE
ADDRESS
CE
2
DATA I/O
t
BW
DON’T CARE
CE#1
BHE#/BLE#
WE#
CE#1
CE2
BHE#/BLE#
WE#
相關(guān)PDF資料
PDF描述
S71GL064A08BAW0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A80BAI0F0 INDUCTOR,TOROID,HORIZONTAL, 22.0 uH,7.0 IDC,0.015 OHM,
S71GL064A80BAI0F2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A80BAI0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A80BAW0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71GL064A80BAW0B3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A80BAW0F0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A80BAW0F2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A80BAW0F3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A80BFI0B0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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