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    參數(shù)資料
    型號: S29GL128M90FFIR12
    廠商: SPANSION LLC
    元件分類: DRAM
    英文描述: 3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
    中文描述: 8M X 16 FLASH 3V PROM, 90 ns, PBGA64
    封裝: 13 X 11 MM, LEAD FREE, FORTIFIED, BGA-64
    文件頁數(shù): 29/160頁
    文件大?。?/td> 2142K
    代理商: S29GL128M90FFIR12
    April 30, 2004 S29GLxxxM_00A5
    S29GLxxxM MirrorBit
    TM
    Flash Family
    29
    P r e l i m i n a r y
    Word/Byte Configuration
    The BYTE# pin controls whether the device data I/O pins operate in the byte or
    word configuration. If the BYTE# pin is set at logic ‘1’, the device is in word con-
    figuration, DQ0–DQ15 are active and controlled by CE# and OE#.
    If the BYTE# pin is set at logic ‘0’, the device is in byte configuration, and only
    data I/O pins DQ0–DQ7 are active and controlled by CE# and OE#. The data I/
    O pins DQ8–DQ14 are tri-stated, and the DQ15 pin is used as an input for the
    LSB (A-1) address function.
    Requirements for Reading Array Data
    To read array data from the outputs, the system must drive the CE# and OE#
    pins to V
    IL
    . CE# is the power control and selects the device. OE# is the output
    control and gates array data to the output pins. WE# should remain at V
    IH
    .
    The internal state machine is set for reading array data upon device power-up,
    or after a hardware reset. This ensures that no spurious alteration of the memory
    content occurs during the power transition. No command is necessary in this
    mode to obtain array data. Standard microprocessor read cycles that assert valid
    addresses on the device address inputs produce valid data on the device data
    outputs. The device remains enabled for read access until the command register
    contents are altered.
    See “Reading Array Data” for more information. Refer to the AC Read-Only Op-
    erations table for timing specifications and the timing diagram. Refer to the DC
    Characteristics table for the active current specification on reading array data.
    Page Mode Read
    The device is capable of fast page mode read and is compatible with the page
    mode Mask ROM read operation. This mode provides faster read access speed for
    random locations within a page. The page size of the device is 4 words/8 bytes.
    The appropriate page is selected by the higher address bits A(max)–A2. Address
    bits A1–A0 in word mode (A1–A-1 in byte mode) determine the specific word
    within a page. This is an asynchronous operation; the microprocessor supplies
    the specific word location.
    The random or initial page access is equal to t
    ACC
    or t
    CE
    and subsequent page
    read accesses (as long as the locations specified by the microprocessor falls
    within that page) is equivalent to t
    PACC
    . When CE# is deasserted and reasserted
    for a subsequent access, the access time is t
    ACC
    or t
    CE
    . Fast page mode accesses
    are obtained by keeping the “read-page addresses” constant and changing the
    “intra-read page” addresses.
    Writing Commands/Command Sequences
    To write a command or command sequence (which includes programming data
    to the device and erasing sectors of memory), the system must drive WE# and
    CE# to V
    IL
    , and OE# to V
    IH
    .
    The device features an
    Unlock Bypass
    mode to facilitate faster programming.
    Once the device enters the Unlock Bypass mode, only two write cycles are re-
    quired to program a word, instead of four. The “Word Program Command
    Sequence” section has details on programming data to the device using both
    standard and Unlock Bypass command sequences.
    An erase operation can erase one sector, multiple sectors, or the entire device.
    Table
    2
    -Table
    13
    indicates the address space that each sector occupies.
    相關(guān)PDF資料
    PDF描述
    S29GL128M90FFIR13 3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
    S29GL128M90FFIR20 MOSFET, Switching; VDSS (V): -60; ID (A): -2; Pch : 1.25; RDS (ON) typ. (ohm) @10V: 0.245; RDS (ON) typ. (ohm) @4V[4.5V]: [0.31]; RDS (ON) typ. (ohm) @2.5V: -; Ciss (pF) typ: 290; toff (&#181;s) typ: 0.037; Package: CMFPAK-6
    S29GL128M90FFIR22 3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
    S29GL128M90FFIR23 MOSFET, Switching; VDSS (V): -60; ID (A): -6; Pch : 3; RDS (ON) typ. (ohm) @10V: 0.04; RDS (ON) typ. (ohm) @4V[4.5V]: [0.06]; RDS (ON) typ. (ohm) @2.5V: -; Ciss (pF) typ: 2300; toff (&#181;s) typ: 0.055; Package: SOP-8
    S29GL128M90FFIR80 MOSFET, Switching; VDSS (V): -60; ID (A): -6; Pch : 3; RDS (ON) typ. (ohm) @10V: 0.04; RDS (ON) typ. (ohm) @4V[4.5V]: [0.06]; RDS (ON) typ. (ohm) @2.5V: -; Ciss (pF) typ: 2300; toff (&#181;s) typ: 0.055; Package: SOP-8
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