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| 型號： | S29GL064N90FFI060 |
| 廠商： | SPANSION LLC |
| 元件分類： | DRAM |
| 英文描述： | 64 Megabit, 32 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 110 nm MirrorBit Process Technology |
| 中文描述： | 4M X 16 FLASH 3V PROM, 90 ns, PBGA64 |
| 封裝： | 13 X 11 MM, LEAD FREE, FBGA-64 |
| 文件頁數(shù)： | 75/79頁 |
| 文件大小： | 2191K |
| 代理商： | S29GL064N90FFI060 |
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November 16, 2007 S29GL-N_01_09
S29GL-N MirrorBit
Flash Family
75
D a t a
S h e e t
17.2
TS056—56-Pin Standard Thin Small Outline Package (TSOP)
6
2
3
4
5
7
8
9
TS 056
MO-142 (D) EC
56
MIN
0.05
0.95
0.17
0.17
0.10
0.10
19.80
18.30
13.90
0.50
0
0.08
0.50 BASIC
0.60
MAX
1.20
0.15
1.05
0.27
0.16
0.21
20.20
8
0.20
18.50
14.10
0.70
0.23
0.20
0.22
1.00
18.40
14.00
20.00
NOM
Symbol
A
Jedec
Package
b1
b
c1
c
A2
A1
D
D1
L
0
R
N
e
E
1
NOTES:
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982)
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE UP).
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN), INK OR LASER MARK.
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS DEFINED AS THE PLANE OF
CONTACT THAT IS MADE WHEN THE PACKAGE LEADS ARE ALLOWED TO REST FREELY ON A FLAT
HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTUSION IS
0.15mm (.0059") PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR PROTUSION SHALL BE
0.08 (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX. MATERIAL CONDITION. MINIMUM SPACE
BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 (0.0028").
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10MM (.0039") AND
0.25MM (0.0098") FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10mm (0.004") AS MEASURED FROM THE SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
N
+1
2
N
1
2
N
3
REVERSE PIN OUT (TOP VIEW)
C
e
A1
A2
2X (N/2 TIPS)
0.10
9
SEATING
PLANE
A
SEE DETAIL A
B
B
A
B
E
D1
D
2X
2X (N/2 TIPS)
0.25
2X
0.10
0.10
N
5
+1
N
2
4
5
1
N
2
2
STANDARD PIN OUT (TOP VIEW)
SEE DETAIL B
DETAIL A
(c)
θ°
L
0.25MM (0.0098") BSC
C
R
GAUGE PLANE
PARALLEL TO
SEATING PLANE
b
b1
(c)
7
6
c1
WITH PLATING
BASE METAL
7
0.08MM (0.0031") M C A - B S
SECTION B-B
DETAIL B
X
e/2
X = A OR B
3356 \ 16-038.10c
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S29GL064N90FFIS20 | 功能描述:閃存 64Mb 3V 90ns Parallel NOR 閃存 RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結(jié)構(gòu):256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| S29GL064N90FFIS30 | 制造商:Spansion 功能描述: 制造商:Spansion 功能描述:64M (8MX8/4MX16) 3V REG, MIRRORBIT, FBGA64, IND, HAZMAT - Trays |
| S29GL064N90FFIS40 | 制造商:Spansion 功能描述: |
| S29GL064N90FFIV22 | 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 64MBIT 8MX8/4MX16 90NS 64BGA - Trays |
| S29GL064N90TA1040 | 制造商:Spansion 功能描述:FLASH - Trays |
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