參數(shù)資料
型號: S29GL064N11BAI012
廠商: Spansion Inc.
英文描述: 64 Megabit, 32 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 110 nm MirrorBit Process Technology
中文描述: 64兆,32兆位3.0伏只頁面模式閃存具有110納米MirrorBit工藝技術
文件頁數(shù): 15/79頁
文件大?。?/td> 2191K
代理商: S29GL064N11BAI012
November 16, 2007 S29GL-N_01_09
S29GL-N MirrorBit
Flash Family
15
D a t a
S h e e t
6.
Ordering Information–S29GL032N
S29GL032N Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
S29GL032N
90
T
A
I
01
0
PACKING TYPE
0
= Tray
2
= 7-inch Tape and Reel
3
= 13-inch Tape and Reel
MODEL NUMBER
01 =
x8/x16, V
CC
= V
IO
= 2.7 – 3.6 V, Uniform sector, WP#/ACC = V
IL
protects highest addressed sector
02 =
x8/x16, V
CC
= V
IO
= 2.7 – 3.6 V, Uniform sector, WP#/ACC = V
IL
protects lowest addressed sector
03 =
x8/x16, V
CC
= 2.7 – 3.6 V, Top boot sector, WP#/ACC = V
IL
protects top two addressed sectors
04 =
x8/x16, V
CC
= 2.7 – 3.6 V, Bottom boot sector, WP#/ACC = V
IL
protects bottom two addressed sectors
V1 =
x8/x16, V
CC
= 2.7 – 3.6 V, V
IO
= 1.65 - 3.6 V, Uniform sector, WP#/ACC = V
IL
protects highest addressed
sector
V2 =
x8/x16, V
CC
= 2.7 – 3.6 V, V
IO
= 1.65 - 3.6 V, Uniform sector, WP#/ACC = V
IL
protects lowest addressed sector
TEMPERATURE RANGE
I
= Industrial (–40°C to +85°C)
PACKAGE MATERIAL SET
A
= Standard
(Note 4)
F
= Pb-Free
PACKAGE TYPE
T
=
Thin Small Outline Package (TSOP) Standard Pinout
B
=
Fine-pitch Ball-Grid Array Package
F
=
Fortified Ball-Grid Array Package
SPEED OPTION
See Product Selector Guide and Valid Combinations (90 = 90 ns, 11 = 110 ns)
DEVICE NUMBER/DESCRIPTION
S29GL032N
32 Megabit Page-Mode Flash Memory
Manufactured using 110 nm MirrorBit
Process Technology, 3.0 Volt-only Read, Program, and Erase
Table 6.1
S29GL032N Ordering Options
(Note 4)
S29GL032N Valid Combinations
Package Description
(Notes)
Device
Number
Speed
Option
Package, Material,
& Temperature Range
Model
Number
Packing
Type
S29GL032N
90
TFI
01, 02
0,2,3
(Note 1)
TS056
(Note 2)
TSOP
11
V1, V2
90
FFI
01, 02
LAA064
(Note 3)
Fortified BGA
11
V1, V2
90
TFI
03, 04
TS048
(Note 2)
TSOP
BFI
VBK048
(Note 3)
Fine-Pitch BGA
FFI
LAA064
(Note 3)
Fortified BGA
Notes
1. Type 0 is standard. Specify others as required: TSOPs can be packed in
Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. TSOP package marking omits packing type designator from ordering
part number.
3. BGA package marking omits leading
S29
and packing type designator
from ordering part number.
4. Contact local sales for availability for Leaded lead-frame parts.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this
device. Consult your local sales office to confirm availability of specific valid
combinations and to check on newly released combinations.
相關PDF資料
PDF描述
S29GL064N11BAI020 64 Megabit, 32 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 110 nm MirrorBit Process Technology
S29GL064N11BAI022 64 Megabit, 32 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 110 nm MirrorBit Process Technology
S29GL064N11BAI030 64 Megabit, 32 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 110 nm MirrorBit Process Technology
S29GL064N11BAI032 64 Megabit, 32 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 110 nm MirrorBit Process Technology
S29GL064N11BAI040 64 Megabit, 32 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 110 nm MirrorBit Process Technology
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