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S29GLxxxM MirrorBitTM Flash Family
S29GLxxxM_00_B3 Octorber 18, 2004
Data s he et
Updated the R3, R4 column replacing -04 and -03 designators with -R4 and -R3 respectively.
Word Program Command Sequence
Included statements documenting word programming support for backward compatibility with existing Flash
drivers.
Physical Dimensions
Removed the BGA-80P-M02 diagram.
Revision A+3 (February 26, 2004)
Distinctive Characteristics
Corrected typo in the Flexible Sector Architecture section.
Revision A+4 (March 24, 2004)
CMOS Compatible
Removed VCC from Max for VOL.
Erase and Program Operations-S29GL256M only
Corrected unit typos.
Erase and Program Operations-S29GL128M only
Corrected the minimum Data Setup Time.
Alternate CE# Controlled Erase and Program Operations-S29GL128M
Corrected the minimum CE# Pulse width.
TSOP Pin and BGA Package Capacitance: Pkg types TB, TC, BB, BC
Added CIN3.
Connection Diagrams
40-pin standard TSOP: Corrected pin 30 to be VIO.
48-pin standard TSOP: Added superscripts to designators for pin 9, 13, 14, 15 and 47. Changed pin 13 to A21.
Added two notes below illustration.
56-pin standard TSOP: Added superscripts to designators for pin 1, 2 and 12. Changed pin 56 to NC. Added three
notes below illustration.
64-ball Fortified BGA: Corrected ball D8 to be VIO. Added superscripts to designators for ball D8, F7, and F1.
Added two notes below illustration.
63-ball Fine-pitch BGA: Added superscript to designator for Ball H7. Added one note below illustration. Added con-
nection diagrams for S29GL064M (model R0) and S29GL032M (model R0).
Pin Description
Added VIO description.
Logic Symbols
Added VIO on all models except R3 and R4.
Figure 3 Write Buffer Programming Operation
Corrected the DQ locations and added callouts to notes one through three.
DC Characteristics
Corrected test conditions for ICC6.