參數(shù)資料
型號(hào)： S29GL032A30BAI013
廠商： Spansion Inc.
英文描述： 64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology
中文描述： 64兆，32兆和16兆位3.0伏只頁(yè)面模式閃存，含有200納米MirrorBit工藝技術(shù)
文件頁(yè)數(shù)： 23/95頁(yè)
文件大?。?/td> 2389K
代理商： S29GL032A30BAI013
September 10, 2007 S29GL-A_00_A11
S29GL-A
23
D a t a
S h e e t
7.1
Word/Byte Configuration
The BYTE# pin controls whether the device data I/O pins operate in the byte or word configuration. If the
BYTE# pin is set at logic
1
, the device is in word configuration, DQ0–DQ15 are active and controlled by CE#
and OE#.
If the BYTE# pin is set at logic
0
, the device is in byte configuration, and only data I/O pins DQ0–DQ7 are
active and controlled by CE# and OE#. The data I/O pins DQ8–DQ14 are tri-stated, and the DQ15 pin is used
as an input for the LSB (A-1) address function.
7.2
Requirements for Reading Array Data
To read array data from the outputs, the system must drive the CE# and OE# pins to V
IL
. CE# is the power
control and selects the device. OE# is the output control and gates array data to the output pins. WE# should
remain at V
IH
.
The internal state machine is set for reading array data upon device power-up, or after a hardware reset. This
ensures that no spurious alteration of the memory content occurs during the power transition. No command is
necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses
on the device address inputs produce valid data on the device data outputs. The device remains enabled for
read access until the command register contents are altered.
See
Reading Array Data
on page 52
for more information. Refer to the AC Read-Only Operations table in
AC
Characteristics
on page 72
for timing specifications and the timing diagram. Refer to
DC Characteristics
on page 70
for the active current specification on reading array data.
7.2.1
Page Mode Read
The device is capable of fast page mode read and is compatible with the page mode Mask ROM read
operation. This mode provides faster read access speed for random locations within a page. The page size of
the device is 4 words/8 bytes. The appropriate page is selected by the higher address bits A(max)–A2.
Address bits A1–A0 in word mode (A1–A-1 in byte mode) determine the specific word within a page. This is
an asynchronous operation; the microprocessor supplies the specific word location.
The random or initial page access is equal to t
ACC
or t
CE
and subsequent page read accesses (as long as the
locations specified by the microprocessor falls within that page) is equivalent to t
PACC
. When CE# is
deasserted and reasserted for a subsequent access, the access time is t
ACC
or t
CE
. Fast page mode
accesses are obtained by keeping the
read-page addresses
constant and changing the
intra-read page
addresses.
7.3
Writing Commands/Command Sequences
To write a command or command sequence (which includes programming data to the device and erasing
sectors of memory), the system must drive WE# and CE# to V
IL
, and OE# to V
IH
.
The device features an
Unlock Bypass
mode to facilitate faster programming. Once the device enters the
Unlock Bypass mode, only two write cycles are required to program a word, instead of four. The
Word
Program Command Sequence
on page 53
contains details on programming data to the device using both
standard and Unlock Bypass command sequences.
An erase operation can erase one sector, multiple sectors, or the entire device.
Table 7.4 on page 27
to
Table 7.22 on page 45
indicate the address space that each sector occupies.
Refer to
DC Characteristics
on page 70
for the active current specification for the write mode.
AC
Characteristics
on page 72
contains timing specification tables and timing diagrams for write operations.
相關(guān)PDF資料
PDF描述
S29GL032A30BAIR10 64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology
S29GL032A30BAIR12 64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology
S29GL032A30BAIR13 64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology
S29GL032A30BAIR20 64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology
S29GL032A30BAIR22 64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S29GL032A30BAIR10 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology
S29GL032A30BAIR12 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology
S29GL032A30BAIR13 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology
S29GL032A30BAIR20 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology
S29GL032A30BAIR22 制造商:SPANSION 制造商全稱:SPANSION 功能描述:64 Megabit, 32 Megabit, and 16 Megabit 3.0-Volt only Page Mode Flash Memory Featuring 200 nm MirrorBit Process Technology
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