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參數(shù)資料
| 型號： | S-AU93A |
| 廠商： | Toshiba Corporation |
| 英文描述： | RF POWER AMPLIFIER MODULE FM RF POWER AMPLIFIER MODULE FOR 60-W COMMERCIAL UHF RADIO APPLICATIONS |
| 中文描述： | 射頻功率放大器模塊調(diào)頻射頻功率放大器模塊，60鎢商業(yè)超高頻無線電應用 |
| 文件頁數(shù)： | 3/5頁 |
| 文件大?。?/td> | 192K |
| 代理商： | S-AU93A |
S-AU93A
2007-06-21
3
HANDLING PRECAUTIONS
Since this product has a protective cap, care should be taken to avoid applying an excessive impact and allowing
foreign objects to get inside when handling this product. Also, please do not remove a cap. If the cap is removed,
the foreign object inside the module or the applied impact may lead IC failure, causing smoke or ignition.
Since this product is structurally susceptible to static electricity, protections against the static electricity should be
applied to objects that may come in direct contact with devices, such as worktables, equipment, operators and
solder irons.
This product is not designed nor intended to perform a continuous transmission for applications like a base station.
Please do not use this product for such applications, for the reliability cannot be guaranteed.
This product is intended to be used for a single operation (single-device operation). A proper operation is not
guaranteed for a parallel operation. A parallel operation should be performed in accordance with your own good
judgment.
Mounting method
The flatness of a heat sink must not exceed 50
μ
m. If the flatness exceeds 50
μ
m, the device may experience
an unexpected stress that may lead to module breakdown due to damage or ignition in the substrate inside a
module and other module parts.
Please apply thermal compound between a module and a heat sink to improve the adhesive property.
Use a 4-mm diameter screw with the clamping screw torque of 1.2 to 1.5 Nm.
Please solder the module leads after the screw is clamped.
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