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參數(shù)資料
| 型號： | RT9198A-4GGBR |
| 廠商： | Richtek Technology Corporation |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 300mA, Low Noise, Ultra-Fast CMOS LDO Regulator |
| 中文描述： | 300mA的，低噪聲，超高速的CMOS LDO穩(wěn)壓器 |
| 文件頁數(shù)： | 10/15頁 |
| 文件大小： | 261K |
| 代理商： | RT9198A-4GGBR |
RT9198/A
10
DS9198/A-10 November 2006
www.richtek.com
Figure 2. Derating Curve for Packages
0
100
200
300
400
500
600
700
0
15
30
Ambient Temperature (°C)
45
60
75
90
105
120
135
M
)
SOT-23-3
SOT-23-5
SC 70-5
SC-82
WDFN-6L 2x2
For recommended operating conditions specification of
RT9198/A, where T
J(MAX)
is the maximum junction
temperature of the die (125
°
C) and T
A
is the maximum
ambient temperature. The junction to ambient thermal
resistance (
θ
JA
is layout dependent) for SOT-23-3/
SOT-23-5 package is 250
°
C/W, SC-70-5 and SC-82
package is 333
°
C/W and WDFN-6L 2x2 package is
165
°
C/W on standard JEDEC 51-3 thermal test board.
The maximum power dissipation at T
A
= 25
°
C can be
calculated by following formula :
P
D(MAX)
= (125
°
C
25
°
C)/250 = 400mW (SOT-23-3/
SOT-23-5)
P
D(MAX)
= (125
°
C
25
°
C)/333 = 300mW (SC-70-5, SC-82)
P
D(MAX)
= (125
°
C
25
°
C) / 165 = 606mW (WDFN-6L 2x2)
The maximum power dissipation depends on opera
ting
ambient temperature for fixed T
J(MAX)
and thermal
resistance
θ
JA
. For RT9198/A packages, the Figure 2. of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
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