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PRODUCT SPECIFICATION
RC2798
11
Package Dimensions
20-pin TSSOP package
A
A1
A2
B
C
D
—
.002
.031
.007
.004
.250
.047
.006
.041
.012
.008
.257
—
0.05
0.80
0.19
0.09
6.40
1.20
0.15
1.05
0.30
0.20
6.60
Symbol
Inches
Min.
Max.
Min.
Max.
Millimeters
Notes
E
E1
e
L
N
.240
.168
.264
.176
6.10
4.30
6.70
4.50
.018
.029
0.45
0.75
.026 BSC
0.65 BSC
0
—
10
.004
0
—
10
0.10
3
6
2, 4
5
5
20
20
a
ccc
Notes:
1.
2.
"D" and "E1" do not include mold flash. Mold flash or
protrusions shall not exceed .010 inch (0.25mm).
"L" is the length of terminal for soldering to a substrate.
Terminal numbers are shown for reference only.
"B" & "C" dimensions include solder finish thickness.
Symbol "N" is the maximum number of terminals.
3.
4.
5.
6.
Dimensioning and tolerancing per ANSI Y14.5M-1982.
E
E1
A
A2
D
e
B
A1
– C –
LEAD COPLANARITY
SEATING
PLANE
a
L
C