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PRODUCT SPECIFICATION
RC5035
11
A
16
9
1
8
D
A
A1
– C –
LEAD COPLANARITY
ccc C
SEATING
PLANE
e
B
L
h x 45
C
a
16 Lead Small Outline IC (SOIC) – .150" Body Width Rev 1.0 11/28/95
E
H
A
A1
B
C
D
.053
.004
.013
.008
.386
.069
.010
.020
.010
.394
1.35
0.10
0.33
0.19
9.80
1.75
0.25
0.51
0.25
10.00
Symbol
Inches
Min.
Max.
Min.
Max.
Millimeters
Notes
E
e
H
h
L
N
a
ccc
.150
.158
3.81
4.00
.228
.010
.016
.244
.020
.050
5.80
0.25
0.40
6.20
0.50
1.27
.050 BSC
1.27 BSC
0
—
8
0
—
8
3
6
5
2
2
16
16
.004
0.10
Notes:
1.
2.
"D" and "E" do not include mold flash. Mold flash or
protrusions shall not exceed .010 inch (0.25mm).
"L" is the length of terminal for soldering to a substrate.
Terminal numbers are shown for reference only.
"C" dimension does not include solder finish thickness.
Symbol "N" is the maximum number of terminals.
3.
4.
5.
6.
Dimensioning and tolerancing per ANSI Y14.5M-1982.
Mechanical Dimensions – 16-Lead SOIC Package