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參數(shù) | 數(shù)值 |
---|---|
Additional Features | 5V Tolerant Memory Protection Unit (MPU) NAND Flash Controller PGA Touch Sensing Interface Vref |
Ambient Operating Temperature(Min-Max)(°C) | -40 to 105 |
Analog Comparator | 4 |
Cache(kByte) | 16 |
Core: Operating Frequency(Max)(MHz) | 120 |
Core: Type | ARM Cortex M4 |
D/A Converter - Bits(bit) | 12 |
Debug Features | cJTAG Serial Wire Debug JTAG |
Device Type | MCU |
EEPROM(kByte) | 0 |
External Bus Interface | Flexbus |
FlexMemory(kByte) | 0 |
I/O Pins | 100 |
Independent ADC modules | 4 |
Internal Flash(kByte) | 1024 |
Internal RAM(kByte) | 128 |
Max Simultaneous ADC channels | 4 DP 58 SE |
Pulse Width Modulators - Channels | 20 |
Sample Exception Availability | N |
Serial Interface - Number of Interfaces | 6 3 2 2 2 2 |
Serial Interface - Type | UART SPI I2C I2S CAN USB |
Supply Voltage(Min-Max)(V) | 1.71 to 3.6 |
Timer type | Low Power Timer Periodic Interrupt Timer Programmable Delay BLOCK |
Total DMA Channels | 32 |
Total Flash memory(kByte) | 1024 |
USB | USB OTG HS USB OTG LS/FS |
Description | Kinetis 1MB USB |
Material Type | Tested Packaged Device |
Life Cycle Description (code) | PRODUCT RAPID GROWTH |
Status | Active |
Application/Qualification Tier | COMMERCIAL, INDUSTRIAL |
Package Description and Mechanical Drawing | LQFP 144 20SQ1.4P0.5 C90 |
Device Weight (g) | 1.33170 |
Pin/Lead/Ball Count | 144 |
Package Length (nominal) (mm) | 20.000 |
Package Width (nominal) (mm) | 20.000 |
Package Thickness (nominal) (mm) | 1.600 |
Maximum Height Above Board (mm) | 1.600 |
Pb-Free | Yes |
Halogen Free | Yes |
Material Composition Declaration (MCD) | Download MCD Report Download MCD Report |
RoHS Certificate of Analysis (CoA) | Download RoHS CoA Report |
2nd Level Interconnect | e3 |
Moisture Sensitivity Level (MSL) | 3 |
Floor Life | 168 HOURS |
Peak Package Body Temperature (PPT)(°C) | 260 |
Maximum Time at Peak Temperature (s) | 40 |
Number of Reflow Cycles | 3 |
REACH SVHC | Freescale REACH Statement |
UL94 (plastics flammability test) | V0: burning stops within 10 seconds on a vertical specimen. no drips allowed |
Micron Size (μm) | .09 |
Minimum Package Quantity (MPQ) | 60 |
Preferred Order Quantity (POQ) | 600 |
Leadtime (weeks) | 10 |
Export Control Classification Number (US) | 3A991A2 |
智能天線原名自適應(yīng)天線陣列,它通過滿足某種準(zhǔn)則的算法去調(diào)節(jié)各陣元信號的加權(quán)幅度和相位,從而調(diào)節(jié)天線陣列的方向圖形狀,以達(dá)到增強(qiáng)所需信號,抑制干擾信號的目的。智能天線技術(shù)適用于TDD方式的CDMA系統(tǒng),能夠在較大程度上抑制多用戶干擾、提高系統(tǒng)容量。
隨著LTE的發(fā)展,對天線帶來了很多干擾,需要進(jìn)行信息化的管理,所以LTE智能天線就成為重點(diǎn)關(guān)注支持的標(biāo)準(zhǔn)配置。智能天線新標(biāo)準(zhǔn)中,智能天線有遠(yuǎn)端天線信息控制RAE,遠(yuǎn)端控制單元(RCU),通訊模塊三部分。其中,一個(gè)基站對應(yīng)3個(gè)天線覆蓋360度,一個(gè)天線一個(gè)頻率對應(yīng)一個(gè)RCU控制單元,一個(gè)RAE模塊互通一個(gè)基站。
核心優(yōu)勢
● RAE模塊內(nèi)置1M FLASH
● 驅(qū)動步進(jìn)電機(jī),實(shí)現(xiàn)正反轉(zhuǎn),PWM脈沖數(shù)
● 28V供電,電流1.5A
● 有溫度,過流等信息通過外圍電路采集
● 內(nèi)部集成閉環(huán)檢測報(bào)警電路
● SPI方式通訊
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