參數(shù)資料
型號(hào): PIC18F87K90T-I/PTRSL
廠商: Microchip Technology
文件頁(yè)數(shù): 2/110頁(yè)
文件大小: 0K
描述: MCU 8BIT 128K FLASH 80-TQFP
標(biāo)準(zhǔn)包裝: 1,200
系列: PIC® XLP™ 18F
核心處理器: PIC
芯體尺寸: 8-位
速度: 64MHz
連通性: I²C,LIN,SPI,UART/USART
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,LCD,POR,PWM,WDT
輸入/輸出數(shù): 69
程序存儲(chǔ)器容量: 128KB(64K x 16)
程序存儲(chǔ)器類型: 閃存
EEPROM 大?。?/td> 1K x 8
RAM 容量: 4K x 8
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 24x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 80-TQFP
包裝: 帶卷 (TR)
2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA3000 Rev. 1.0.5
10
FS
A3
0
00
Two
-Port,
High
-Spe
ed,
M
HL
Swi
tch
Physical Dimensions
Figure 18. 10-Lead, MicroPak
TM 1.6 x 2.1 mm JEDEC MO255B
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
BOTTOM VIEW
TOP VIEW
RECOMMENDED LAND PATTERN
SIDE VIEW
2X
NOTES:
A. PACKAGE CONFORMS TO JEDEC
REGISTRATION MO-255, VARIATION UABD .
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. PRESENCE OF CENTER PAD IS PACKAGE
SUPPLIER DEPENDENT. IF PRESENT IT
IS NOT INTENDED TO BE SOLDERED AND
HAS A BLACK OXIDE FINISH.
E. DRAWING FILENAME: MKT-MAC10Arev5.
0.10 C
0.10
C A B
0.05
C
PIN1 IDENT IS
2X LONGER THAN
OTHER LINES
A
B
C
0.35
0.25
9X
1
4
9
6
0.25
0.15
10
5
0.50
0.56
1.62
0.05
0.00
0.05 C
0.55 MAX
0.05 C
1.60
2.10
(0.35)
(0.25)
0.50
10X
(0.11)
1.12
1.62
KEEPOUT ZONE, NO TRACES
OR VIAS ALLOWED
(0.20)
(0.15)
0.35
0.25
0.35
0.25
DETAIL A
DETAIL A 2X SCALE
0.35
0.25
0.65
0.55
D
ALL FEATURES
(0.36)
(0.29)
0.56
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