參數(shù)資料
型號(hào): PIC16LF1507-I/P
廠商: Microchip Technology
文件頁(yè)數(shù): 240/266頁(yè)
文件大小: 0K
描述: IC MCU 8BIT 3.5KB FLASH 20PDIP
產(chǎn)品培訓(xùn)模塊: Configurable Logic Cell
8-bit PIC® Microcontroller Portfolio
標(biāo)準(zhǔn)包裝: 22
系列: PIC® 16F
核心處理器: PIC
芯體尺寸: 8-位
速度: 20MHz
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,PWM,WDT
輸入/輸出數(shù): 17
程序存儲(chǔ)器容量: 3.5KB(2K x 14)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 128 x 8
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 12x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 20-DIP(0.300",7.62mm)
包裝: 管件
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)第162頁(yè)第163頁(yè)第164頁(yè)第165頁(yè)第166頁(yè)第167頁(yè)第168頁(yè)第169頁(yè)第170頁(yè)第171頁(yè)第172頁(yè)第173頁(yè)第174頁(yè)第175頁(yè)第176頁(yè)第177頁(yè)第178頁(yè)第179頁(yè)第180頁(yè)第181頁(yè)第182頁(yè)第183頁(yè)第184頁(yè)第185頁(yè)第186頁(yè)第187頁(yè)第188頁(yè)第189頁(yè)第190頁(yè)第191頁(yè)第192頁(yè)第193頁(yè)第194頁(yè)第195頁(yè)第196頁(yè)第197頁(yè)第198頁(yè)第199頁(yè)第200頁(yè)第201頁(yè)第202頁(yè)第203頁(yè)第204頁(yè)第205頁(yè)第206頁(yè)第207頁(yè)第208頁(yè)第209頁(yè)第210頁(yè)第211頁(yè)第212頁(yè)第213頁(yè)第214頁(yè)第215頁(yè)第216頁(yè)第217頁(yè)第218頁(yè)第219頁(yè)第220頁(yè)第221頁(yè)第222頁(yè)第223頁(yè)第224頁(yè)第225頁(yè)第226頁(yè)第227頁(yè)第228頁(yè)第229頁(yè)第230頁(yè)第231頁(yè)第232頁(yè)第233頁(yè)第234頁(yè)第235頁(yè)第236頁(yè)第237頁(yè)第238頁(yè)第239頁(yè)當(dāng)前第240頁(yè)第241頁(yè)第242頁(yè)第243頁(yè)第244頁(yè)第245頁(yè)第246頁(yè)第247頁(yè)第248頁(yè)第249頁(yè)第250頁(yè)第251頁(yè)第252頁(yè)第253頁(yè)第254頁(yè)第255頁(yè)第256頁(yè)第257頁(yè)第258頁(yè)第259頁(yè)第260頁(yè)第261頁(yè)第262頁(yè)第263頁(yè)第264頁(yè)第265頁(yè)第266頁(yè)
PIC16(L)F1507
DS41586A-page 75
Preliminary
2011 Microchip Technology Inc.
8.0
POWER-DOWN MODE (SLEEP)
The Power-Down mode is entered by executing a
SLEEP
instruction.
Upon entering Sleep mode, the following conditions exist:
1.
WDT will be cleared but keeps running, if
enabled for operation during Sleep.
2.
PD bit of the STATUS register is cleared.
3.
TO bit of the STATUS register is set.
4.
CPU clock is disabled.
5.
31 kHz LFINTOSC is unaffected and peripherals
that operate from it may continue operation in
Sleep.
6.
ADC is unaffected, if the dedicated FRC clock is
selected.
7.
I/O ports maintain the status they had before
SLEEP
was executed (driving high, low or high-
impedance).
8.
Resets other than WDT are not affected by
Sleep mode.
Refer to individual chapters for more details on
peripheral operation during Sleep.
To minimize current consumption, the following
conditions should be considered:
I/O pins should not be floating
External circuitry sinking current from I/O pins
Internal circuitry sourcing current from I/O pins
Current draw from pins with internal weak pull-ups
Modules using 31 kHz LFINTOSC
CWG, NCO and CLC modules using HFINTOSC
I/O pins that are high-impedance inputs should be
pulled to VDD or VSS externally to avoid switching
currents caused by floating inputs.
Examples of internal circuitry that might be sourcing
current include the FVR module. See Section 13.0
for
more
information on this module.
8.1
Wake-up from Sleep
The device can wake-up from Sleep through one of the
following events:
1.
External Reset input on MCLR pin, if enabled
2.
BOR Reset, if enabled
3.
POR Reset
4.
Watchdog Timer, if enabled
5.
Any external interrupt
6.
Interrupts by peripherals capable of running dur-
ing Sleep (see individual peripheral for more
information)
The first three events will cause a device Reset. The
last three events are considered a continuation of pro-
gram execution. To determine whether a device Reset
or wake-up event occurred, refer to Section 6.11
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be enabled. Wake-up will
occur regardless of the state of the GIE bit. If the GIE
bit is disabled, the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
enabled, the device executes the instruction after the
SLEEP
instruction, the device will then call the Interrupt
Service Routine. In cases where the execution of the
instruction following SLEEP is not desirable, the user
should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
8.1.1
WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
If the interrupt occurs before the execution of a
SLEEP
instruction
- SLEEP instruction will execute as a NOP.
- WDT and WDT prescaler will not be cleared
-TO bit of the STATUS register will not be set
-PD bit of the STATUS register will not be
cleared.
If the interrupt occurs during or after the execu-
tion of a SLEEP instruction
- SLEEP instruction will be completely exe-
cuted
- Device will immediately wake-up from Sleep
- WDT and WDT prescaler will be cleared
-TO bit of the STATUS register will be set
-PD bit of the STATUS register will be cleared
相關(guān)PDF資料
PDF描述
V150C12H150BL CONVERTER MOD DC/DC 12V 150W
5-1814826-1 CONN JACK F BLK R/M RG-59B/U
PIC16LF1903-I/MV MCU 7KB FLASH LCD DVR 28-UQFN
V150C12H150B2 CONVERTER MOD DC/DC 12V 150W
MS27484P12B35P CONN PLUG 22POS STRAIGHT W/PINS
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PIC16LF1507T-I/ML 功能描述:8位微控制器 -MCU 3.5KB Flash 128B RAM 18I/O 10bit ADC RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16LF1507T-I/SO 功能描述:8位微控制器 -MCU 3.5KB Flash 128B RAM 18I/O 10bit ADC RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16LF1507T-I/SS 功能描述:8位微控制器 -MCU 3.5KB Flash 128B RAM 18I/O 10bit ADC RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16LF1508-E/ML 功能描述:8位微控制器 -MCU 7KB FLASH 256B RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT
PIC16LF1508-E/P 功能描述:8位微控制器 -MCU 7KB FLASH 256B RAM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT