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    參數(shù)資料
    型號(hào): PIC16CE623-04I/P
    廠商: Microchip Technology
    文件頁數(shù): 97/100頁
    文件大?。?/td> 0K
    描述: IC MCU OTP 512X14 EE COMP 18DIP
    產(chǎn)品培訓(xùn)模塊: Asynchronous Stimulus
    8-bit PIC® Microcontroller Portfolio
    標(biāo)準(zhǔn)包裝: 25
    系列: PIC® 16C
    核心處理器: PIC
    芯體尺寸: 8-位
    速度: 4MHz
    外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,WDT
    輸入/輸出數(shù): 13
    程序存儲(chǔ)器容量: 896B(512 x 14)
    程序存儲(chǔ)器類型: OTP
    EEPROM 大?。?/td> 128 x 8
    RAM 容量: 96 x 8
    電壓 - 電源 (Vcc/Vdd): 3 V ~ 5.5 V
    振蕩器型: 外部
    工作溫度: -40°C ~ 85°C
    封裝/外殼: 18-DIP(0.300",7.62mm)
    包裝: 管件
    配用: 309-1059-ND - ADAPTER 18 ZIF BD W/18SO PLUGS
    DVA16XP180-ND - ADAPTER DEVICE FOR MPLAB-ICE
    AC164010-ND - MODULE SKT PROMATEII DIP/SOIC
    其它名稱: PIC16CE623-04I/PR
    PIC16CE623-04I/PR-ND
    PIC16CE62X
    DS40182C-page 86
    1999 Microchip Technology Inc.
    13.1
    DC CHARACTERISTICS:
    PIC16CE62X-04 (Commercial, Industrial, Extended)
    PIC16CE62X-20 (Commercial, Industrial, Extended)
    DC CHARACTERISTICS
    Standard Operating Conditions (unless otherwise stated)
    Operating temperature
    –40
    °C ≤ TA ≤ +85°C for industrial and
    0
    °C ≤ TA ≤ +70°C for commercial and
    –40
    °C ≤ TA ≤ +125°C for extended
    Param
    No.
    Sym
    Characteristic
    Min
    Typ
    Max Units
    Conditions
    D001
    VDD
    Supply Voltage
    3.0
    5.5
    V
    D002
    VDR
    RAM Data Retention
    Voltage (Note 1)
    1.5*
    V
    Device in SLEEP mode
    D003
    VPOR
    VDD start voltage to
    ensure Power-on Reset
    –VSS
    V
    See section on power-on reset for details
    D004
    SVDD
    VDD rise rate to ensure
    Power-on Reset
    0.05*
    V/ms See section on power-on reset for details
    D005
    VBOR
    Brown-out Detect Voltage
    3.7
    4.0
    4.35
    V
    BOREN configuration bit is cleared
    D010
    IDD
    Supply Current (Note 2, 4)
    1.2
    0.4
    1.0
    4.0
    35
    2.0
    1.2
    2.0
    6.0
    7.0
    70
    mA
    A
    FOSC = 4 MHz, VDD = 5.5V, WDT disabled,
    XT osc mode, (Note 4)*
    FOSC = 4 MHz, VDD = 3.0V, WDT disabled,
    XT osc mode, (Note 4)
    FOSC = 10 MHz, VDD = 3.0V, WDT disabled,
    HS osc mode, (Note 6)
    FOSC = 20 MHz, VDD = 4.5V, WDT disabled,
    HS osc mode
    FOSC = 20 MHz, VDD = 5.5V, WDT disabled*,
    HS osc mode
    FOSC = 32 kHz, VDD = 3.0V, WDT disabled,
    LP osc mode
    D020
    IPD
    Power Down Current (Note 3)
    2.2
    5.0
    9.0
    15
    A
    VDD = 3.0V
    VDD = 4.5V*
    VDD = 5.5V
    VDD = 5.5V Extended
    D022
    D022A
    D023
    D023A
    IWDT
    IBOR
    ICOMP
    IVREF
    WDT Current (Note 5)
    Brown-out Reset Current (Note 5)
    Comparator Current for each
    Comparator (Note 5)
    VREF Current (Note 5)
    6.0
    75
    30
    80
    10
    12
    125
    60
    135
    A
    VDD = 4.0V
    (125
    °C)
    BOD enabled, VDD = 5.0V
    VDD = 4.0V
    IEE Write
    IEE Read
    IEE
    Operating Current
    Standby Current
    3
    1
    30
    100
    mA
    A
    VCC = 5.5V, SCL = 400 kHz
    VCC = 3.0V, EE VDD = VCC
    1A
    FOSC
    LP Oscillator Operating Frequency
    RC Oscillator Operating Frequency
    XT Oscillator Operating Frequency
    HS Oscillator Operating Frequency
    0
    200
    4
    20
    kHz
    MHz
    All temperatures
    *
    These parameters are characterized but not tested.
    Data in "Typ" column is at 5.0V, 25
    °C, unless otherwise stated. These parameters are for design guidance only and are not
    tested.
    Note 1:
    This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
    2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin loading and
    switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current con-
    sumption.
    The test conditions for all IDD measurements in active operation mode are:
    OSC1 = external square wave, from rail to rail; all I/O pins tri-stated, pulled to VDD,
    MCLR = VDD; WDT enabled/disabled as specified.
    3: The power down current in SLEEP mode does not depend on the oscillator type. Power down current is measured with the
    part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
    4: For RC osc configuration, current through Rext is not included. The current through the resistor can be estimated by the for-
    mula Ir = VDD/2Rext (mA) with Rext in k
    .
    5: The
    current is the additional current consumed when this peripheral is enabled. This current should be added to the base
    IDD or IPD measurement.
    6: Commercial temperature range only.
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