參數(shù)資料
型號(hào): PCA9674N
廠商: NXP SEMICONDUCTORS
元件分類: 微控制器/微處理器
英文描述: Remote 8-bit I/O expander for Fm+ I2C-bus with interrupt
中文描述: 8 I/O, PIA-GENERAL PURPOSE, PDIP16
封裝: 0.300 INCH, PLASTIC, MO-001, SOT38-1, DIP-16
文件頁(yè)數(shù): 29/34頁(yè)
文件大?。?/td> 179K
代理商: PCA9674N
PCA9674_PCA9674A_2
NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 12 October 2006
29 of 34
NXP Semiconductors
PCA9674/74A
Remote 8-bit I/O expander for Fm+ I
2
C-bus with interrupt
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10
and
11
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 29
.
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”
Table 10.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
350
220
220
< 2.5
2.5
Table 11.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
MSL: Moisture Sensitivity Level
Fig 29. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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