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參數資料
| 型號： | PCA9674A |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Remote 8-bit I/O expander for Fm+ I2C-bus with interrupt |
| 中文描述： | 遠程8位I / O擴展調頻I2C總線的中斷 |
| 文件頁數： | 31/34頁 |
| 文件大?。?/td> | 179K |
| 代理商： | PCA9674A |
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PCA9674_PCA9674A_2
NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 12 October 2006
31 of 34
NXP Semiconductors
PCA9674/74A
Remote 8-bit I/O expander for Fm+ I
2
C-bus with interrupt
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note(AN01026); order a copy from your NXP
Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with
respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of
the moisture in them (the so called popcorn effect).
[3]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
[4]
Hot bar soldering or manual soldering is suitable for PMFP packages.
[5]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed
through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217
°
C
±
10
°
C
measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[6]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate
between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the
heatsink surface.
[7]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction. The package footprint
must incorporate solder thieves downstream and at the side corners.
[8]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for
packages with a pitch (e) equal to or smaller than 0.65 mm.
[9]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely
not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[10] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil.
However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate
soldering profile can be provided on request.
17. Abbreviations
Surface mount
BGA, HTSSON..T
[5]
, LBGA,
LFBGA,SQFP,SSOP..T
[5]
,TFBGA,
VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP,
HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
[7]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
[10]
, WQCCN..L
[10]
not suitable
suitable
not suitable
[6]
suitable
suitable
not recommended
[7][8]
not recommended
[9]
not suitable
suitable
suitable
suitable
not suitable
Table 12.
Mounting
Suitability of IC packages for wave, reflow and dipping soldering methods
…continued
Package
[1]
Soldering method
Wave
Reflow
[2]
Dipping
Table 13.
Acronym
CDM
CMOS
ESD
GPIO
HBM
LED
IC
I
2
C-bus
Abbreviations
Description
Charged Device Model
Complementary Metal Oxide Semiconductor
ElectroStatic Discharge
General Purpose Input/Output
Human Body Model
Light Emitting Diode
Integrated Circuit
Inter-Integrated Circuit bus
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相關代理商/技術參數 |
參數描述 |
|---|---|
| PCA9674ABS,118 | 功能描述:接口-I/O擴展器 8-BIT I2C FM+ QB RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9674ABS,118-CUT TAPE | 制造商:NXP 功能描述:PCA9674 Series 1 MHz 8 bit I/O Expander Fm + I2C Bus with Interrupt - HVQFN-16 |
| PCA9674ABS-T | 功能描述:接口-I/O擴展器 8-BIT I2C FM+ QB GPIO RST PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9674AD | 功能描述:接口-I/O擴展器 8-BIT I2C FM+ QB GPIO INT PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9674AD,512 | 功能描述:接口-I/O擴展器 8-BIT I2C FM+ QB RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
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