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參數(shù)資料
| 型號： | PCA9536TK,118 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 10/22頁 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 4B 8HVSON |
| 產(chǎn)品培訓模塊： | I²C Bus Fundamentals |
| 特色產(chǎn)品： | NXP - I2C Interface |
| 標準包裝： | 1 |
| 接口： | I²C，SM 總線 |
| 輸入/輸出數(shù)： | 4 |
| 中斷輸出： | 無 |
| 頻率 - 時鐘： | 400kHz |
| 電源電壓： | 2.3 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-VFDFN 裸露焊盤 |
| 供應商設(shè)備封裝： | 8-HVSON |
| 包裝： | 標準包裝 |
| 包括： | POR |
| 產(chǎn)品目錄頁面： | 825 (CN2011-ZH PDF) |
| 配用： | 568-3615-ND - DEMO BOARD I2C |
| 其它名稱： | 568-4079-6 |
PCA9536_5
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 05 — 25 January 2010
18 of 22
NXP Semiconductors
PCA9536
4-bit I2C-bus and SMBus I/O port
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 19) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 12 and 13
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 19.
Table 12.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 13.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA9536TK-T | 功能描述:接口-I/O擴展器 4-BIT I2C FM TP GPIO PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9536YZPR | 功能描述:接口-I/O擴展器 Remote 4B I2C and SMBus I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9537 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:4-bit I2C-bus and SMBus low power I/O port with interrupt and reset |
| PCA9537DP | 制造商:NXP Semiconductors 功能描述:IC IO PORT I2C/SMBUS 4BIT 1 制造商:NXP Semiconductors 功能描述:IC, IO PORT, I2C/SMBUS 4BIT, 10TSSOP 制造商:NXP Semiconductors 功能描述:IC, IO PORT, I2C/SMBUS 4BIT, 10TSSOP; Chip Configuration:4bit; Bus Frequency:400kHz; Interface Type:I2C, SMBus; Supply Voltage Min:2.3V; Supply Voltage Max:5.5V; Digital IC Case Style:TSSOP; No. of Pins:10; No. of I/O's:4; MSL:MSL 1 ;RoHS Compliant: Yes |
| PCA9537DP,118 | 功能描述:接口-I/O擴展器 I2C/SMBUS 4BIT GPIO RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
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