參數(shù)資料
型號(hào): PC27.09.0100A
廠商: Taoglas Limited
文件頁數(shù): 6/12頁
文件大?。?/td> 1022K
描述: ANTENNA 4-BAND GSM PCB W/CABLE
標(biāo)準(zhǔn)包裝: 50
天線類型: PCB 印制線
頻帶數(shù)目: 4
頻率: 800MHz,900MHz,1.8GHz,1.9GHz
VSWR: 3.59,2.02,2.21,2.3
端子: MMCX,帶 100mm 纜線
安裝類型: 連接器
高度(最大): 0.8mm
包裝: 散裝
其它名稱: 931-1050
 
?All Rights Reserved
Taoglas Limited, Unit 3 Enniscorthy Technology Centre, Enniscorthy, Co. Wexford, Ireland
www.taoglas.com
 
 
5.0 Environmental Conditions and Reliability
5.1 Environmental Conditions
 
5.1.1   Operation Temperature
-20?/SPAN>C to + 65?/SPAN>C
5.1.2   Storage Temperature
-30?/SPAN>C to + 75?/SPAN>C
5.1.3   Relative Humidity
40% to 95%
 
5.2 Reliability
Test Items
Procedure
Requirement
hermal Shock
Starting at -40 for 30minutes and then cycled to +85
to remain 30minutes (a complete cycle).
To repeat 5 complete cycles.
(Refer to IEC 68-2-14 Method Na)
1.     The value of return loss must be within
product specifications after this test.
2.     No physical deformation should be evident.
Storage
Temperature
(Cold)
Samples must be put into -30癈 chamber for 72
hours and samples shall be powered during test.
(Refer to IEC 68-2-1 Method Aa)
1.     The value of return loss must be within
product specifications after this test.
2.   No physical deformation should be evident.
Storage
Temperature
(Dry Heat)
Samples must be put into +75癈 chamber for 72
hours and samples shall be powered during test.
(Refer to IEC 68-2-1 Method Ba)
1.    The value of return loss must be within
product specifications after this test.
2.    No physical deformation should be evident.
Operating
Temperature
(Cold)
Samples must be put into -20癈 chamber for 2
hours and samples shall be powered during test.
(Refer to IEC 68-2-1 Method Aa)
1. The value of return loss must met specification
during test/after test
2. No mechanical defects after test.
Operating
Temperature
(Dry Heat)
Samples must be put into +65癈 chamber for 72
hours and samples shall be powered during test.
(Refer to IEC 68-2-1 Method Ba)
1. The value of return loss must met specification
during test/after test
2. no mechanical defects after test.
 
 
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