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參數(shù)資料
| 型號： | P0402FC05C-LF |
| 廠商： | PROTEK DEVICES |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | 250 W, BIDIRECTIONAL, SILICON, TVS DIODE |
| 封裝： | ROHS COMPLIANT, 0402, FLIP CHIP-4 |
| 文件頁數(shù)： | 4/5頁 |
| 文件大?。?/td> | 78K |
| 代理商： | P0402FC05C-LF |
4
05107.R10 2/07
www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”
P0402FC3.3C*
thru
P0402FC36C*
APPLICATION INFORMATION
TP
Ramp-Up
Maximum Solder Reflow
(35-53°C Above Maximum Solder Melt Temp)
Ramp-Down
Solder-Time
15-20 seconds
Ramp-Up
15 seconds
(Minimize)
30-60 seconds
Preheat
Flux Activation Temp
Temperature
-°C
Solder Melt (Maximum Temp)
(Stay Below Flux Activation Temp)
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50m
±20m
60 Seconds
270°C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature:
T
P for Lead-Free (SnAgCu):
260-270°C
T
P for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
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