![](http://datasheet.mmic.net.cn/370000/OR2T04A-2PS84_datasheet_16726875/OR2T04A-2PS84_112.png)
Data Sheet
June 1999
ORCA Series 2 FPGAs
112
Lucent Technologies Inc.
A23
PT15D
PT17D
PT19A
PT23A
PT28A
I/O-RDY/
RCLK
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O-D7
I/O
I/O
I/O
I/O-V
DD
5
I/O
I/O
I/O
I/O
I/O
I/O-D6
I/O
I/O
I/O
I/O
I/O-D5
I/O
I/O
I/O
I/O-D4
I/O
I/O
I/O
I/O-D3
I/O
I/O
I/O-V
DD
5
I/O-D2
I/O-D1
I/O
B22
D22
C22
A22
B21
D20
C21
A21
B20
A20
C20
B19
D18
A19
C19
B18
A18
B17
C18
A17
D17
B16
C17
A16
B15
A15
C16
B14
D15
A14
C15
B13
D13
A13
C14
B12
C13
PT15C
PT15B
PT15A
PT14D
PT14C
PT14B
PT14A
PT13D
—
PT13C
—
PT13B
—
PT13A
—
PT12D
PT12C
PT12B
PT12A
PT11D
PT11C
PT11B
PT11A
PT10D
PT10C
PT10B
PT10A
PT9D
PT9C
PT9B
PT9A
PT8D
PT8C
PT8B
PT8A
PT7D
PT7C
PT17C
PT17B
PT17A
PT16D
PT16C
PT16B
PT16A
PT15D
PT15C
PT15B
PT15A
PT14D
PT14C
PT14B
PT14A
PT13D
PT13C
PT13B
PT13A
PT12D
PT12C
PT12B
PT12A
PT11D
PT11C
PT11B
PT11A
PT10D
PT10C
PT10B
PT10A
PT9D
PT9C
PT9B
PT9A
PT8D
PT8C
PT18D
PT18C
PT18A
PT17D
PT17C
PT17B
PT17A
PT16D
PT16C
PT16B
PT16A
PT15D
PT15C
PT15B
PT15A
PT14D
PT14C
PT14B
PT14A
PT13D
PT13C
PT13B
PT13A
PT12D
PT12C
PT12B
PT12A
PT11D
PT11C
PT11B
PT11A
PT10D
PT10C
PT10B
PT10A
PT9D
PT9C
PT22D
PT22C
PT22A
PT21D
PT21C
PT21B
PT21A
PT20D
PT20C
PT20B
PT20A
PT19D
PT19C
PT19B
PT19A
PT18D
PT18C
PT18B
PT18A
PT17D
PT17A
PT16D
PT16A
PT15D
PT15A
PT14D
PT14A
PT13D
PT13C
PT13B
PT13A
PT12D
PT12C
PT12B
PT12A
PT11D
PT11A
PT27D
PT27C
PT27A
PT26D
PT26C
PT26B
PT26A
PT25D
PT25C
PT25B
PT25A
V
DD
5
PT24C
PT24B
PT23D
PT22D
PT22A
PT21D
PT21A
PT20D
PT20A
PT19D
PT19A
PT18D
PT18A
PT17D
PT17A
PT16D
PT16C
PT16B
PT16A
PT15D
PT15C
V
DD
5
PT15A
PT14D
PT14A
Pin Information
(continued)
Table 27. OR2C/2T10A, OR2C/2T12A, OR2C/2T15A/B, OR2C/2T26A, and OR2T40A/B 352-Pin PBGA
Pinout
(continued)
Pin
2C/2T10A Pad
2C/2T12A Pad
2C/2T15A/B Pad
2C/2T26A Pad OR2T40A/B Pad
Function
Notes:
The pins labeled I/O-V
DD
5 are user I/Os for the OR2CxxA and OR2TxxB series, but they are connected to V
DD
5 for the OR2TxxA series.
The pins labeled V
SS
-ETC are the 6 x 6 array of thermal balls located at the center of the package. The balls can be attached to the ground plane
of the board for enhanced thermal capability (see Table 29), or they can be left unconnected.