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4
OPT201
DICE INFORMATION
PAD
FUNCTION
1
2
3
4
5
6
7
V+
–In
V–
1M
Feedback
Output
NC
NC
Common
8A, 8B
NC: No Connection. Pads 8A and 8B must both be con-
nected to common. Substrate Bias: The substrate is electri-
cally connected to internal circuitry. Do not make electrical
connection to the substrate.
PIN CONFIGURATION
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with ap-
propriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
OPT201 DIE TOPOGRAPHY
Photodiode Area
0.090 x 0.090 inch
2.29 x 2.29 mm
Supply Voltage ...................................................................................
±
18V
Input Voltage Range (Common Pin) ....................................................
±
V
S
Output Short-Circuit (to ground)............................................... Continuous
Operating Temperature..................................................... –25
°
C to +85
°
C
Storage Temperature ........................................................ –25
°
C to +85
°
C
Junction Temperature ...................................................................... +85
°
C
Lead Temperature (soldering, 10s)................................................ +300
°
C
(Vapor-Phase Soldering Not Recommended)
ABSOLUTE MAXIMUM RATINGS
SPECIAL PACKAGE INFORMATION
To provide consistent optical properties, the OPT201 is not
marked on the top of the 8-pin plastic DIP. It is identified by
a special marking “YY” on the package bottom next to pin 8.
See “Pin Configuration Diagram.”
The fire-retardant fillers used in black plastic packages are not
compatible with the clear molding compound used for the
OPT201KP. The OPT201KP cannot meet the flamability test,
UL-94.
MECHANICAL INFORMATION
MILS (0.001")
MILLIMETERS
Die Size
Die Thickness
Min. Pad Size
154 x 120
±
5
20
±
3
4 x 4
3.91 x 3.05
±
0.13
0.51
±
0.08
0.1 x 0.1
Backing
None
V+
–In
V–
1M
Feedback
Common
NC
NC
Output
1
2
3
4
8
7
6
5
TOP VIEW
(1)
NOTE: (1) Photodiode location.
(2) Model identification mark "YY"
on package bottom, next to pin 8.
(2)
PACKAGE INFORMATION
(1)
PACKAGE DRAWING
NUMBER
MODEL
PACKAGE
OPT201KP
8-Pin DIP
006-1
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.