參數(shù)資料
型號: OPA602CM
英文描述: High-Speed Precision Difet OPERATIONAL AMPLIFIER
中文描述: 高速精密運(yùn)算放大器Difet
文件頁數(shù): 7/9頁
文件大小: 150K
代理商: OPA602CM
OPA602
7
COMMON-MODE REJECTION
vs FREQUENCY
140
1
Frequency (Hz)
C
10
100
1k
10k
100k
1M
10M
120
100
80
60
40
20
0
POWER SUPPLY REJECTION
vs FREQUENCY
140
1
Frequency (Hz)
P
10
100
1k
10k
100k
1M
10M
120
100
80
60
40
20
0
+
BIAS AND OFFSET CURRENT
vs INPUT COMMON MODE VOLTAGE
10
1
0.1
0.01
B
–15
Common-Mode Voltage (V)
10
1
0.1
0.01
O
–10
–5
0
5
10
15
Bias Current
Offset Current
BIAS AND OFFSET CURRENT
vs TEMPERATURE
10nA
B
–50
Ambient Temperature (°C)
10nA
O
–25
0
25
50
75
100
125
1nA
100
10
1
0.1
1nA
100
10
1
0.1
TYPICAL PERFORMANCE CURVES
(CONT)
T
A
= +25
°
C, V
S
=
±
15VDC unless otherwise noted.
APPLICATIONS INFORMATION
Unity-gain stability with good phase margin and excellent
output drive characteristics bring freedom from the subtle
problems associated with other high speed amplifiers. But
with any high speed, wide bandwidth circuitry, careful
circuit layout will ensure best performance. Make short,
direct interconnections and avoid stray wiring capacitance—
especially at the inverting input pin.
Power supplies should be bypassed with good high fre-
quency capacitors positioned close to the op amp pins. In
most cases 0.1
μ
F ceramic capacitors are adequate. Applica-
tions with heavier loads and fast transient waveforms may
benefit from use of additional 1.0
μ
F tantalum bypass capaci-
tors.
INPUT BIAS CURRENT GUARDING
Leakage currents across printed circuit boards can easily
exceed the input bias current of the OPA602. A circuit board
“guard” pattern (Figure 1) is an effective solution to difficult
leakage problems. This guard pattern must be repeated on all
layers of a multilayer board. By surrounding critical high
impedance input circuitry with a low impedance circuit
connection at the same potential, leakage currents will flow
harmlessly to the low impedance node.
Input bias current may also be degraded by improper han-
dling or cleaning. Contamination from handling parts and
circuit boards may be cleaned with appropriate solvents and
deionized water. Each rinsing operation should be followed
by a 30-minute bake at +85
°
C.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
OPA602SM 制造商:Rochester Electronics LLC 功能描述:HIGH SPD OP AMP - Bulk
OPA603 制造商:BB 制造商全稱:BB 功能描述:High Speed, Current-Feedback, High Voltage OPERATIONAL AMPLIFIER
OPA603AP 功能描述:高速運(yùn)算放大器 DIP-8 High-Speed Cu RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
OPA603AU 功能描述:高速運(yùn)算放大器 SOIC-16 High Speed RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
OPA604 制造商:TI 制造商全稱:Texas Instruments 功能描述:FET-Input, Low Distortion OPERATIONAL AMPLIFIER