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參數(shù)資料
| 型號： | NS5A4684SMNTBG |
| 廠商： | ON Semiconductor |
| 文件頁數(shù)： | 3/8頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ANLG SWITCH DUAL SPDT 10WQFN |
| 標(biāo)準(zhǔn)包裝： | 3,000 |
| 功能： | 開關(guān) |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 10-WFQFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 10-WQFN（1.4x1.8） |
| 包裝： | 帶卷 (TR) |
NS5A4684S
http://onsemi.com
3
DC CHARACTERISTICS DIGITAL SECTION (Voltages Referenced to GND)
Symbol
Parameter
Condition
VCC
Guaranteed Limit
Unit
25°C
40
°C to +85°C
VIH
Minimum HighLevel Input Voltage, Select
Inputs
3.0
5.0
1.4
2.4
1.4
2.4
V
VIL
Maximum LowLevel Input Voltage, Select
Inputs
3.0
5.0
0.7
0.8
0.7
0.8
V
IIN
Maximum Input Leakage Current, Select
Inputs
VIN = VCC or GND
5.0
±0.1
±1.0
mA
IOFF
Power Off Leakage Current
VIN = VCC or GND
0
±0.5
±2.0
mA
ICC
Maximum Quiescent Supply Current
(Note 2)
Select and VIS = VCC or GND
1.65 to 5.0
±1.0
±2.0
mA
2. Guaranteed by design. Resistance measurements do not include test circuit or package resistance.
DC ELECTRICAL CHARACTERISTICS ANALOG SECTION
Symbol
Parameter
Condition
VCC
Guaranteed Maximum Limit
Unit
25°C
40°C to +85°C
Min
Max
Min
Max
RON
NC/NO OnResistance
(Note 3)
VIN = VIL or VIN = VIH
VIS = GND to VCC
ICOM = 100 mA
3.0
4.3
5.0
0.55
0.45
0.4
0.6
0.5
W
RFLAT
NC/NO OnResistance Flatness
ICOM = 100 mA
VIS = 0 to VCC
3.0
4.3
5.0
0.16
0.11
0.20
0.14
W
DRON
OnResistance Match Between Channels
VIS = 1.5 V;
ICOM = 100 mA
VIS = 2.2 V;
ICOM = 100 mA
3.0
4.3
5.0
0.10
0.11
W
INC(OFF)
INO(OFF)
NC or NO Off Leakage Current (Note 3)
VIN = VIL or VIH
VNO or VNC = 0.3 V
VCOM = 4.0 V
5.0
50
nA
ICOM(ON) COM ON
Leakage Current
(Note 3)
VIN = VIL or VIH
VNO 0.3 V or 4.0 V with
VNC floating or
VNC 0.3 V or 4.0 V with
VNO floating
VCOM = 0.3 V or 4.0 V
5.0
10
100
nA
3. Guaranteed by design. Resistance measurements do not include test circuit or package resistance.
4. Flatness is defined as the difference between the maximum and minimum value of Onresistance as measured over the specified analog
signal ranges.
5. DRON = RON(MAX) RON(MIN) between NC1 and NC2 or between NO1 and NO2.
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