V
參數(shù)資料
型號: NL17SZ08DFT2G
廠商: ON Semiconductor
文件頁數(shù): 2/7頁
文件大小: 0K
描述: IC GATE AND SGL LOG SINPT SOT353
產(chǎn)品變化通告: Wire Change for SC88/A 17/Jun/2011
標準包裝: 1
系列: 17SZ
邏輯類型: 與門
電路數(shù): 1
輸入數(shù): 2
電源電壓: 1.65 V ~ 5.5 V
電流 - 靜態(tài)(最大值): 1µA
輸出電流高,低: 32mA,32mA
額定電壓和最大 CL 時的最大傳播延遲: 4.5ns @ 5V,50pF
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
供應(yīng)商設(shè)備封裝: SC-70
封裝/外殼: 6-TSSOP(5 引線),SC-88A,SOT-353
包裝: 標準包裝
產(chǎn)品目錄頁面: 1126 (CN2011-ZH PDF)
其它名稱: NL17SZ08DFT2GOSDKR
NL17SZ08
http://onsemi.com
2
PIN ASSIGNMENT
(SOT353/SC705/SC88A/SOT553)
Pin
1
2
3
4
5
Function
IN B
IN A
GND
OUT Y
VCC
Input
FUNCTION TABLE
B
L
H
L
H
Output
Y = AB
Y
L
H
A
L
H
PIN ASSIGNMENT (SOT953)
Pin
1
2
3
4
5
Function
IN A
GND
IN B
OUT Y
VCC
MAXIMUM RATINGS
Symbol
Parameter
Value
Units
VCC
DC Supply Voltage
0.5 to +7.0
V
VIN
DC Input Voltage
0.5 to +7.0
V
VOUT
DC Output Voltage (SOT353/SC705/SC88A/SOT553 Packages)
0.5 to VCC +0.5
V
VOUT
DC Output Voltage
Output at High or Low State
(SOT953 Package)
PowerDown Mode (VCC = 0 V)
0.5 to VCC + 0.5
0.5 to + 0.5
V
IIK
DC Input Diode Current
50
mA
IOK
DC Output Diode Current
VOUT < GND, VOUT > VCC
(SOT353/SC705/SC88A/SOT553 Packages)
±50
mA
IOK
DC Output Diode Current (SOT953 Package)
VOUT < GND
50
mA
IOUT
DC Output Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±100
mA
TSTG
Storage Temperature Range
65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
qJA
Thermal Resistance
SOT353 (Note 1)
SOT553
350
496
°C/W
PD
Power Dissipation in Still Air at 85°CSOT353
SOT553
186
135
mW
MSL
Moisture Sensitivity
Level 1
FR
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
ESD
ESD Classification
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
2 kV
400 V
N/A
ILATCHUP
Latchup Performance Above VCC and Below GND at 125°C (Note 5)
±100
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2ounce copper trace with no air flow.
2. Tested to EIA/JESD22A114A, rated to EIA/JESD22A114B.
3. Tested to EIA/JESD22A115A, rated to EIA/JESD22A115A.
4. Tested to JESD22C101A.
5. Tested to EIA/JESD78.
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