參數(shù)資料
型號： NCV8503PDW25
廠商： ON SEMICONDUCTOR
元件分類： 固定正電壓單路輸出LDO穩(wěn)壓器
英文描述： 2.5 V FIXED POSITIVE LDO REGULATOR, PDSO16
封裝： EXPOSED PAD, SOW-16
文件頁數(shù)： 12/12頁
文件大?。?/td> 89K
代理商： NCV8503PDW25
NCV8503 Series
http://onsemi.com
9
Figure 10. 16 Lead SOW (Exposed Pad),
qJA as a
Function of the Pad Copper Area (2 oz. Cu
Thickness), Board Material = 0.0625
, G10/R4
40
70
90
100
Thermal
Resistance,
Junction
to
Ambient,
R
q
JA
,(
°C/W)
0
Copper Area (mm2)
200
400
800
80
60
50
600
CALCULATING POWER DISSIPATION IN A
SINGLE OUTPUT LINEAR REGULATOR
The maximum power dissipation for a single output
regulator (Figure 11) is:
PD(max) + [VIN(max) * VOUT(min)]IOUT(max)
(1)
) VIN(max)IQ
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current for the
application, and
IQ is the quiescent current the regulator consumes at
IOUT(max).
Once the value of PD(max) is known, the maximum
permissible value of RqJA can be calculated:
R
qJA +
150
°C * TA
PD
(2)
The value of RqJA can then be compared with those in the
package section of the data sheet. Those packages with
RqJA’s less than the calculated value in equation 2 will keep
the die temperature below 150
°C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
SMART
REGULATOR
IQ
Control
Features
IOUT
IIN
Figure 11. Single Output Regulator with Key
Performance Parameters Labeled
VIN
VOUT
}
HEAT SINKS
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of RqJA:
R
qJA + RqJC ) RqCS ) RqSA
(3)
where:
RqJC = the junctiontocase thermal resistance,
RqCS = the casetoheatsink thermal resistance, and
RqSA = the heatsinktoambient thermal resistance.
RqJC appears in the package section of the data sheet. Like
RqJA, it too is a function of package type. RqCS and RqSA are
functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.
相關(guān)PDF資料
PDF描述
NCV8503PDW33R2 3.3 V FIXED POSITIVE LDO REGULATOR, PDSO16
NCV8503PDW33 3.3 V FIXED POSITIVE LDO REGULATOR, PDSO16
ND2012L-2-18 160 mA, 200 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-226AA
NDB6030L/S62Z 52 A, 30 V, 0.0135 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB
NDB7052/L86Z 75 A, 50 V, 0.01 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
NCV8503PW25 功能描述:低壓差穩(wěn)壓器 - LDO 2.5V 400mA w/ENABLE RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20
NCV8503PW25G 功能描述:低壓差穩(wěn)壓器 - LDO 2.5V 400mA w/ENABLE RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20
NCV8503PW25R2 功能描述:低壓差穩(wěn)壓器 - LDO 2.5V 400mA w/ENABLE RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20
NCV8503PW25R2G 功能描述:低壓差穩(wěn)壓器 - LDO 2.5V 400mA w/ENABLE RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20
NCV8503PW33 功能描述:低壓差穩(wěn)壓器 - LDO 3.3V 400mA w/ENABLE RoHS:否 制造商:Texas Instruments 最大輸入電壓:36 V 輸出電壓:1.4 V to 20.5 V 回動電壓（最大值）:307 mV 輸出電流:1 A 負載調(diào)節(jié):0.3 % 輸出端數(shù)量: 輸出類型:Fixed 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-20
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